Punching Out: What Do Buyers Expect?
Material Insight: A Conversation with Congressman Blake Moore
It’s Only Common Sense: Going Well Beyond the NormThree Industry Rising Stars Recognized at IPC APEX EXPO 2023
January 31, 2023 | IPCEstimated reading time: 1 minute
In recognition of their leadership roles and support of IPC standards, education, advocacy, and solutions to industry challenges, three of the industry’s best and brightest were presented with an IPC Rising Star Award at IPC APEX EXPO 2023. Award recipients were Sarah Czaplewski-Campbell, Paige Fiet, and Christina Trussell.
Sarah Czaplewski-Campbell is a senior PCB reliability engineer and master inventor at IBM. An active participant in IPC standards committees, she received a Distinguished Committee Service Award for her contributions to the development of IPC-9121-A, Troubleshooting for Printed Board Fabrication Processes. Czaplewski-Campbell completed the IPC Emerging Engineers program in 2022 and currently serves on the IPC APEX EXPO technical program committee, reviewing technical content and chairing technical sessions. A contributor to the technical conference, she was awarded Best Paper in 2021.
Paige Fiet, TTM Technologies, was IPC’s first Student Director on the IPC Board of Directors. She currently serves as vice-chair of the 5-33B Solder Mask Performance Task Group and co-chair of the 7-24A Printed Board Process Effects Handbook Task Group, a member of the IPC APEX EXPO Technical Conference Program Committee and serves on an additional six standards development committees. She completed the IPC Emerging Engineer Program this year.
Christina Trussell, Blue Origin, joined the IPC/WHMA-A-620 committee in 2018. She currently serves as vice chair of the 7-31FS IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group, responsible for the IPC/WHMA-A-620 Space Addendum. Trussell also participated as a judge for the 2021 IPCEF Scholarships and served on a career panel for high school and college students at the 2021 APEX EXPO virtual event. She completed the IPC Emerging Engineer Program this year.
“We are thrilled to recognize the accomplishments of our Rising Stars and to take this opportunity to thank them for their contributions,” said John W. Mitchell, IPC president and CEO. “We are privileged that Sarah, Paige, and Christina have chosen to share their knowledge and expertise with us and with the entire global electronics manufacturing industry.”
Share on:
Suggested Items
AIM Debuts New NC259FPA Ultrafine No Clean Solder Paste
11/30/2023 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection
11/27/2023 | Real Time with...productronicaKoh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning
11/27/2023 | HyRelHyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Mek Launches the SpectorBOX X1: A Revolution in 3D THT Inspection
11/24/2023 | Mek (Marantz Electronics)Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
The Finer Points: World Champions of the IPC Hand-Soldering Finals
11/21/2023 | Pete Starkey, I-Connect007Productronica 2023 played host to the IPC World Hand Soldering Competition, bringing talented regional solder champions from all over the globe to compete for the title of World Champion. Each competitor was given sixty minutes to assemble a complex printed circuit board with their performance judged in accordance with IPC-A-610 Class 3 criteria. Each competitor’s efforts were rated on the merits of the results achieved, scored on the quality of the assembly process, the electrical functionality of the assembly and the speed at which the assembly was produced.