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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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IPC SummerCom to Co-Locate with EWPTE
January 31, 2023 | IPCEstimated reading time: Less than a minute

The IPC SummerCom Standards Development Committee Meetings will be held in-person, from May 13–18, 2023, at the Wisconsin Center in Milwaukee, Wisconsin. IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE), the industry’s exclusive trade show for decision-makers who design, specify, purchase, install, sell, maintain or manufacture electronic cable assemblies, cord sets, wiring harnesses, and other related products.
IPC SummerCom is all about IPC Standards—welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Moreover, registering to IPC Summercom provides attendees free access to EWPTE. The IPC Standard Development Committees cover a range of topics, including assembly and joining; assembly equipment, base materials, cleaning and coating; electronic product data description; embedded devices; flexible and rigid-flex printed boards; management; printed electronics; and more.
For more information or to register, contact Kim DiCianni, CEM, at KimDiCianni@ipc.org, or visit https://www.ipc.org/event/ipc-summercom.
Suggested Items
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.
Europlacer Expands U.S. Reach with New Eastern Region Representative
06/30/2025 | EuroplacerEuroplacer, a global leader in flexible SMT assembly solutions for High-Mix manufacturers, is pleased to announce the appointment of Photo Chemical Systems as its new representative for the Eastern United States.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.