IPC SummerCom to Co-Locate with EWPTE

Reading time ( words)

The IPC SummerCom Standards Development Committee Meetings will be held in-person, from May 13–18, 2023, at the Wisconsin Center in Milwaukee, Wisconsin. IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE), the industry’s exclusive trade show for decision-makers who design, specify, purchase, install, sell, maintain or manufacture electronic cable assemblies, cord sets, wiring harnesses, and other related products.

IPC SummerCom is all about IPC Standards—welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Moreover, registering to IPC Summercom provides attendees free access to EWPTE. The IPC Standard Development Committees cover a range of topics, including assembly and joining; assembly equipment, base materials, cleaning and coating; electronic product data description; embedded devices; flexible and rigid-flex printed boards; management; printed electronics; and more.

For more information or to register, contact Kim DiCianni, CEM, at KimDiCianni@ipc.org, or visit https://www.ipc.org/event/ipc-summercom.


Suggested Items

PCB Technologies Sees Substrates as a Foundation

10/27/2022 | Nolan Johnson, I-Connect007
In this interview, PCB Technologies CEO Oved Shapira discusses the company's move into advanced packaging and heterogenous integration. Shapira explains how substrates and advanced packaging fit into the PCB fab and assembly ecosystem, and makes the argument that an all-inclusive fabrication and assembly supplier can be of great value to customers in product development and small scale production.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/09/2022 | Andy Shaughnessy, I-Connect007
It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai! But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?

IPC Advanced Packaging Symposium to Draw Industry, Government Representatives

08/22/2022 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with IPC’s Chris Mitchell, vice president of global government relations, and Matt Kelly, chief technologist, about the inaugural IPC Advanced Packaging Symposium, scheduled for October 11-12, 2022 in Washington, DC. In this conversation, Mitchell and Kelly detail the symposium's objectives, presenters, and the value to both fabricators and assemblers in attending.

Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.