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I-Connect007 Editor’s Choice: Five Must-Reads For the Week
February 3, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes

It’s Feb. 3, 2023—2/3/23—and now we know the results of yesterday’s Groundhog weather forecast straight from Gobbler’s Knob in Pennsylvania. Punxsutawney Phil says six more weeks of winter. If you’re watching the ongoing ice storms blanketing much of the United States at present, that seems like a safe bet.
Also a safe bet is that the most-read news this week is IPC APEX EXPO related. Additionally, this week IPC published its EMS and PCB numbers for December. All told, lots of industry news to read this week.
For readers who closely follow our weekly must-reads, I’m stepping in for Andy Shaughnessy, who’s been busy covering DesignCon this week. It feels a little similar to Bill Murray in “Groundhog Day,” where Andy’s in a never-ending loop of on-the-road news reporting. I’m happy to step in for our road warrior this week.
These five news items might be my pick for the week, but I also encourage you to visit www.realtimewith.com to watch our on-the-floor video interviews; there is much to learn there. We’ll be publishing these interviews to our newsletters as well over the next few weeks (of winter, if you believe Punxsutawney Phil.) Or you can binge on them right now.
NIST Resources for CHIPS Act Participants
Published January 27
This concise article was originally published in the January issue of SMT007 Magazine and summarizes some of the key resources available to our industry through NIST. This information was presented at IPC’s advanced packaging symposium in October 2022. At the symposium, government representatives shared that CHIPS Act proposals would start being accepted in February 2023. Could it be that’s leading to increased interest in resources such as these?
IPC APEX EXPO Wrap-up
Published January 30
Managing editor Andy Shaughnessy’s post-show dispatch historically is a go-to piece for readers. Andy’s knack for capturing both the business and the fun of the show is one of the reasons for his popularity, I’m sure. This year’s newsletter report does not disappoint. Get a feel for the buzz, in Andy’s very own words.
North American EMS Industry Down 2.7% in December
Published January 27
Shawn DuBravac, IPC’s chief economist, is quoted in the report, “Looking forward, the economic climate is set to deteriorate in the first half of 2023. Despite this, overall industry demand appears to be holding up and backlogs appear healthy.” For 2022 overall, shipments were up and orders were down. The heavy weight of recession fears hangs like a dark cloud, but what does it mean for you?
North American PCB Industry Sales Down 1.7% in December
Published January 27
The December industry report from IPC showed a mixed bag of increases and decreases, suggesting that there is still more settling to do. Commenting on the PCB fabrication numbers, Shawn DuBravac, IPC’s chief economist stated, “Some of the weakness in this month's book-to-bill reflects uneven shipments figures in recent months. December results showed a second consecutive month of improvement. For the year, order were down 6.5 percent while shipments were up 10.1 percent.” Click through here to find out how to access the full report.
SMTA Seeks Applications for 2023 Stromberg Scholarship
Published February 2
As we face a skilled talent shortage in our industry, every opportunity to encourage young students to pursue a career in on electronics need to be stressed. Likewise, getting students involved in the industry organizations early in their studies is a solid strategy for mentoring and retaining that student talent. SMTA’s JoAnn Stromberg Scholarship celebrates students pursuing electronics who are also involved in the SMTA. Read about the scholarship here, then spread the word to the young people you know.
Secret Hidden Bonus Pick!
Don't Blink: The IPC APEX EXPO Time-lapse
Published January 31
The show floor time-lapse is one of our most popular videos each year. The media production team—Bryson Matties, Mike Radogna, Bryan Bernas, and our other unsung heroes at the show—make it a point to get this camera rolling as soon as we have access to our booth. Given how many views this video captures after the show, you all enjoy it just as much as we do.
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Brent Fischthal - Koh YoungSuggested Items
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.
Technica Hosts In-House Visit from PCBAA
10/01/2025 | Technica USADavid Schild, Executive Director of PCBAA (Printed Circuit Board Association of America) visited Technica USA to discuss the activity in the market and the advocacy of the PCBAA. The organization was formed to work on Capitol Hill, educating, advocating and getting congressional support to legislate on behalf of building a stronger PCB and substrate manufacturing base in the U.S.A.