-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
New Plan Period in the Long-Term Incentive Scheme Directed to Aspocomp’s Management
February 15, 2023 | AspocompEstimated reading time: 1 minute
The Board of Directors of Aspocomp Group Plc has approved the commencement of a new performance period within the share-based long-term incentive scheme for the company’s top management and selected key employees, the Performance Share Plan (PSP).
Aspocomp Group originally announced the establishment of the long-term incentive scheme with a stock exchange release issued on July 20, 2022.
The next plan within the PSP structure, PSP 2023-2025, commences as of the beginning of 2023 and the share rewards potentially earned thereunder will be paid during H1 2026. The payment of the rewards is conditional on the achievement of the performance targets set by the Board of Directors for the plan.
The performance measures based on which the potential share rewards under PSP 2023-2025 will be paid are cumulative EBIT and the total shareholder return of Aspocomp’s share (absolute TSR).
Eligible for participation in PSP 2023-2025 are approximately 20 individuals, including the members of Aspocomp’s Management Team.
If all the performance targets set for PSP 2023–2025 are fully achieved, the aggregate maximum number of shares payable as a reward based on this plan is approximately 91,000 shares (referring to gross earning before the withholding of the applicable payroll tax).
The maximum value of the rewards payable to the participants based on PSP 2023-2025 is limited by a cap which is linked to Aspocomp’s share price development.
Aspocomp applies a share ownership recommendation to the members of the company’s Management Team. According to this recommendation each member of Aspocomp’s Management Team is expected to retain in his/her ownership at least half of the shares received under the share-based incentive plans of the company until the value of his/her share ownership in the company in case of the President and CEO corresponds to at least the CEO’s annual gross base salary and in case of the other members of the Management Team to half of the individual’s annual gross base salary.
Suggested Items
Zhen Ding Releases November 2024 Monthly Revenue Report
12/06/2024 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, today reported November 2024 revenue of NT$19,434 million, up 3.15% YoY, reaching the second highest for the same period in the company’s history.
ROHM Semiconductor, Valeo Co-Develop the Next Generation of Power Electronics
12/03/2024 | Globe NewswireROHM Semiconductor and Valeo, a leading automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management
HPC Customer Engages Sondrel for High End Chip Design
11/25/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.
Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24
11/25/2024 | Compal Electronics Inc.Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.
Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications
11/25/2024 | ACCESSWIREAeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.