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Zhen Ding Releases November 2024 Monthly Revenue Report

12/06/2024 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, today reported November 2024 revenue of NT$19,434 million, up 3.15% YoY, reaching the second highest for the same period in the company’s history.

ROHM Semiconductor, Valeo Co-Develop the Next Generation of Power Electronics

12/03/2024 | Globe Newswire
ROHM Semiconductor and Valeo, a leading automotive technology company, today announced they are collaborating to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management

HPC Customer Engages Sondrel for High End Chip Design

11/25/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips, has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer.

Compal, ZutaCore Collaborate to Showcase Groundbreaking Waterless Two-Phase Liquid Cooling Server Solutions at SC24

11/25/2024 | Compal Electronics Inc.
Compal Electronics, a global leader in server innovation, has partnered with ZutaCore®, a leading provider of waterless direct-to-chip two-phase liquid cooling (2P DLC) solutions, to introduce a series of groundbreaking server solutions.

Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications

11/25/2024 | ACCESSWIRE
Aeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
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