- smt007 Magazine
In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
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- smt007 Magazine
StenTech Promotes Raza Khan to Central Area Sales ManagerMarch 13, 2023 | StenTech
Estimated reading time: Less than a minute
StenTech Inc., the leading multinational SMT Printing Solutions company, announced the promotion of Raza Khan to Central Area Sales Manager. Khan has been managing StenTech’s Chicago facility for the past 14 years. He embodies a unique knowledge of the company and products that he will utilize in his technical sales role.
Khan graduated with a Bachelor of Science in Electronics and then began his career with StenTech in 2005. He initially joined StenTech as a machine operator and was soon promoted to CAD Designer. Backed by the insight of these roles, he was the natural choice to transition into management where he has excelled in supporting StenTech’s customers.
StenTech has been leading the way in stencil technology, being the first company to introduce Fiber Diode lasers into North America. With more than 30 experienced CAD designers, their strength is the support they provide in stencil modifications, materials and thickness recommendations. StenTech, incorporates sub-brands, PhotoStencil and ADT and offers a complete array of stencil technology, custom-tailored to suit your manufacturing requirements. They manufacture all types of stencils for the SMT industry.
Intel celebrated the arrival of its Intel 4 technology, which uses extreme ultraviolet (EUV) technology, and the first use of EUV in high-volume manufacturing (HVM) in Europe.
There has always been pressure to reduce line and space as we have seen the bleeding edge technology go from 8 mils to 5 mils and then to 3 mils. The difference between “then” and “now” is that the prior advancements, for the most part, used the same processes, chemistry and equipment going from 8 mils to 3 mils. But going from 3 mil to sub 1 mil trace and space is a quantum leap in printed circuit board (PCB) technology that requires a whole new set of processes and materials.
Pacific Northwest National Laboratory is collaborating with leading technology companies Microsoft Corp. and Micron Technology to make computational chemistry—a challenging subject but one with far-reaching significance for our lives—broadly available to applied researchers and industrial users.
The Semiconductor Industry Association (SIA) announced Geoff Martha, chairman and CEO of healthcare technology leader Medtronic, will be the keynote presenter at the 2023 SIA Awards Dinner on Thursday, Nov. 16 in San Jose, Calif.
Despite being a leader in R&D investment in semiconductors and packaging with greater than $50 billion per year, the U.S. has seen its market share decrease to less than 3% in areas like advanced packaging and advanced substrates. The cause for this market share erosion was a laser focus in Asian countries to attract semiconductors and advanced packaging investment through ecosystem development and incentives. If the U.S. is serious about changing the momentum to onshore advanced packaging and advanced substrates, an ecosystem approach to innovation and manufacturing incentives must be employed. It is not enough to have the most innovative technology if the supply chain and manufacturing economics do not deliver competitive commercial opportunities.