NextFlex Launches $4.4M Hybrid Electronics Funding Opportunity
March 22, 2023 | Business WireEstimated reading time: 1 minute

NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, released Project Call 8.0 (PC 8.0), the latest call for proposals that seek to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing that support Department of Defense priorities. The total PC 8.0 project value is expected to exceed $9.4M (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $134M.
Building from the success and maturity of past Project Calls, PC 8.0 continues the use of broadly defined topics to enable a diverse proposer base, with special emphasis on areas in which FHE can impact high priority U.S. manufacturing opportunities and areas of emerging importance within the FHE community. Areas of emphasis include FHE-enabled manufacturing for applications in additive packaging, high performance interconnects, applications in harsh environments including space, and reducing environmental and climate impacts of electronics manufacturing with FHE approaches.
"This new funding opportunity carries the momentum from previous project calls to elevate the level of sophistication of FHE-enabled devices, extend hybrid electronic manufacturing process capability, and enhance environmental sustainability," said Scott Miller, NextFlex Director of Technology. "As FHE technology’s potential has been more fully demonstrated, we are now able to focus on meeting the reliability, standardization, and advancing technology transition into the U.S. industrial manufacturing base."
All project proposals for PC 8.0 should include elements to advance technology transitions while maintaining focusing on manufacturing challenges in these topic areas:
- Additively Manufactured 3D Devices with Increased Complexity
- High Performance FHE Interconnects
- Harsh Environment Hybrid Electronic Components with Proven Reliability
- Advancing the Manufacturability of FHE Processes Towards Standardization
- Environmentally Sustainable FHE Manufacturing, Design Strategies, and Use-Cases
- Open Topic for "New Project Leads"
In addition, NextFlex announces the release of its latest FHE Technology Roadmaps. Developed by subject matter experts from industry, academia and government, the NextFlex Technical Working Groups in 11 technical areas of emphasis – Automotive; Device Integration & Packaging; Materials; Modeling & Design; Printed Components & Microfluidics; Standards, Test & Reliability; Asset Monitoring Systems; Flexible Power; Human Monitoring Systems; Integrated Antenna Arrays; and Soft Wearable Robotics – update the roadmaps each year. The roadmaps contain detailed information on the current state of the art, market opportunities and needs, key stakeholders, a five-year forward-looking development roadmap, and prioritized technical gaps identified by each Technical Working Group. These roadmaps inform the priorities for NextFlex Project Calls.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
KIC Expands Footprint in Mexico to Deliver Faster, Localized Support
08/29/2025 | KICKIC, a leading provider of thermal process solutions for electronics manufacturing, has announced the expansion of its service capabilities in Mexico.
SEMICON Europa 2025 Spotlights Global Collaborations for European Economic Resilience
08/28/2025 | SEMISEMICON Europa 2025, co-located with productronica, will return to Munich from November 18-21 to mark its 50th anniversary, bringing together global industry leaders, innovators, and policymakers to strengthen Europe’s position in the global semiconductor landscape. Registration is open.
North American EMS Industry Shipments Down 4.1% in July
08/27/2025 | Global Electronics AssociationThe Global Electronics Association announced today the July 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.23.
SIA Statement on Semiconductor Tariffs Announcement
08/27/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding President Trump’s semiconductor tariff announcement.
SMTA Elects New Board Members
08/27/2025 | SMTAThe SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning October 19, 2025. Elizabeth Benedetto, HP Inc.; Pratish Patel, Electronic Interconnect; and Sutharshan Suppiramaniam, SMT Elite Corporation, have been newly elected to the Board of Directors for the term 2025-2028.