‘Deepfake’ Components
Global Citizenship: Our Strength Comes From Working Together
Global Sourcing Spotlight: The Importance of Cooperative PartnershipsiNEMI Packaging Tech Topic Series Evolution of Power Packaging
March 23, 2023 | iNEMIEstimated reading time: Less than a minute
Make plans to join us for iNEMI’s March Packaging Tech Topic webinar. Power electronics have become increasingly important in modern electronic systems. Andy Mackie, PhD, of Indium Corporation will be talking about the evolution of power electronics packaging, focusing in particular on advancements in assembly and thermal interface materials.
The webinar will cover:
- Challenges associated with power electronics packaging and the critical role that assembly and thermal interface materials play in addressing these challenges
- Impact of emerging technologies such as silicon carbide (SiC) and gallium nitride (GaN) on power electronics packaging and the new challenges they pose
- An in-depth analysis of the different types of materials used in power electronics packaging, their advantages, and limitations
- The future direction of power electronics packaging and the potential for further advancements in assembly and thermal interface materials to enable even more efficient and reliable power electronic systems
Evolution of Power Packaging: Assembly and Thermal Interface Materials
Presented by Andy Mackie, PhD, Indium Corporation
Tuesday, March 28, 2023
9:00-10:00 a.m. EDT (US)
3:00-4:00 p.m. CEST (Europe)
22:00-23:00 p.m. JST (Japan)
For more information visit iNEMI's website.
Share on:
Suggested Items
Foxconn Reports Strong September 2024 Revenue
10/07/2024 | FoxconnHon Hai Precision Industry Co., Ltd. (Foxconn) announced its unaudited consolidated revenue for September 2024, reaching NT$528.3 billion. This marks a 12.87% month-on-month increase and a 14.44% year-on-year growth, driven by robust performance across all major product lines.
Battling Counterfeit Electronics in Manufacturing
10/07/2024 | Nolan Johnson, I-Connect007Paul Jarski, product development manufacturing leader at Case New Holland (CNH), discusses his extensive experience with counterfeit electronics throughout his career. He highlights the challenges faced during market allocations, where counterfeit parts infiltrated supply chains and causing significant issues. Paul recounts the rigorous processes implemented to detect and prevent counterfeits, including advanced material analysis and testing. Counterfeit parts occasionally slipped through despite these measures, leading to costly and time-consuming audits and verifications to ensure product integrity and safety.
IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers
10/07/2024 | IPCA new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to improve the supply chain resiliency of U.S.-based artificial intelligence (AI) data centers and the electronics used in them.
Indian PCB Market Projected to Reach $20.17 billion by 2032
10/04/2024 | openPRThe Indian printed circuit board (PCB) market has witnessed significant growth in recent years, reaching a value of USD 4.53 billion in 2023.
MIRTEC Celebrates 20 Year Milestone Anniversary
10/04/2024 | MIRTECMIRTEC Co., LTD, “The Global Leader in Inspection Technology,” proudly celebrates the 20th anniversary of its North American Sales and Service Division, MIRTEC Corp.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in