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Founder of HyRel Technologies Brian Watson to Present at SMTA International on Workforce Development

09/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce that Brian Watson, the company’s Founder and President, will be a featured presenter at SMTA International. The event is scheduled to take place on Tuesday, October 10.

Pivoting on Substrates

09/27/2023 | I-Connect007 Editorial Team
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.

Airbus Unveils PioneerLab as its New Twin-engine Flying Laboratory

09/26/2023 | Airbus
During the German National Aviation Conference in Hamburg, Airbus Helicopters unveiled the PioneerLab, its new twin-engine technology demonstrator based on the H145 platform.

Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies

09/26/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced the expansion of its node-to-node design migration flow based on the Cadence® Virtuoso® Studio, which is compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.

HyRel Technologies Achieves Coveted AS9100 Certification, Elevating Aerospace Excellence

09/25/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, proudly announces that it earned the prestigious AS9100 certification.
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