Raytheon, Northrop Grumman Team Down-selected for US Army's Next-generation Precision Strike Missile
March 27, 2023 | Business WireEstimated reading time: 1 minute
The U.S. Army selected Raytheon Technologies to advance its design for the Long Range Maneuverable Fires program, intended to become Precision Strike Missile (PrSM) Increment 4. Working collaboratively with Northrop Grumman, the team will mature its innovative design, featuring advanced propulsion technology as a key enabler for extending range, as well as enhancements for survivability and lethality.
During this phase of the program, Raytheon and Northrop Grumman will partner to co-design, build and test the propulsion subsystem for DeepStrike®-ER, an advanced missile solution that will demonstrate the capability to achieve the Army’s desired range and effectiveness against next-generation threats.
“Our experience in developing the most sophisticated missile technologies in the world uniquely positions Raytheon to partner with the Army to address this high-priority modernization program,” said Tom Laliberty, president of Land Warfare & Air Defense at Raytheon Missiles & Defense. “This legacy, coupled with our creative partnerships to bring together proven technologies, enables us to deliver a superior solution that meets or exceeds the requirements for the critical long-range precision fires mission.”
“Northrop Grumman’s ongoing investment in new propulsion technologies and infrastructure support the growing need for efficient and effective missile systems,” said Jim Kalberer, vice president of Missile Products at Northrop Grumman. “Our mission-tailored solution will include advanced propulsion technology and key components designed to increase capacity within the launch system and achieve optimal range extension.”
Developed in collaboration with the Australian Defence Forces, this next-generation weapon is the U.S. Army’s future long-range precision strike missile, offering improved capabilities over the Army Tactical Missile System to engage a variety of threats with unparalleled range and accuracy. The missile, which is being procured and developed in four increments addressing specific operational requirements, is designed for integration into currently fielded Army platforms.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Ynvisible Expands into South America Through Strategic Collaboration with ED Technologies
10/22/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leading provider of printed low-power e-paper display products, is pleased to announce a strategic partnership with ED Technologies to support market development across South America, with an initial focus on Brazil.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.