-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
ZESTRON Senior Application Engineer, Ravi Parthasarathy, to Present at the SMTA STAR Forum
March 29, 2023 | ZESTRONEstimated reading time: Less than a minute

ZESTRON, a leading global provider of high precision cleaning products, services, and training solutions for the electronics manufacturing industry, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting his paper "Process Considerations for Defluxing Ultra-Fine Pitch Die on CoWs" at the SMTA High Reliability: Strategic Technology Advancement Research Forum on April 18, 2023, in Kansas City, MO, USA.
SMTA High Reliability: Strategic Technology Advancement Research Forum:
The SMTA High Reliability Forum is a highly anticipated annual event that provides a platform for leading industry experts to discuss and share their latest research findings and insights on emerging trends and challenges in the electronics manufacturing industry. This year's theme, "Advanced Packaging Technologies for High Reliability Applications," will focus on the latest advancements in packaging technologies for applications such as automotive, aerospace, and medical devices.
As a Senior Application Engineer at ZESTRON, Ravi Parthasarathy has extensive experience in the development and implementation of innovative cleaning processes for electronics manufacturing. His paper will highlight the challenges associated with defluxing ultra-fine pitch die on CoWs (Chip-on-Wire) and will provide insights into process considerations for achieving reliable and effective cleaning results.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.