-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSolder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
Certifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
MacDermid Alpha Electronics Solutions Expands its Argomax Sintering Technologies
April 4, 2023 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/1816/9087/1308/ALPHA_Argomax.jpg)
MacDermid Alpha, one of the world’s largest providers of circuitry, assembly, and semiconductor solutions for electronics manufacturers, has expanded the Argomax® technology offering. Argomax® 2148 is a new silver sintering product, designed for electric vehicle power inverters. The sintered joint enables the fabrication of smaller, lighter, and reliable power train systems.
MacDermid Alpha’s range of Argomax silver sintering pastes offer flexibility and ease-of-use while reducing manufacturing cost and time to market. These pastes, applied by low-pressure processing are designed for die, top side, or package attach. Argomax pastes are available in wet and dry options.
Argomax 2148 enables the sintering of large packages or components on gold or silver substrates. Utilizing a pure silver bond line, the dispensable silver sintering paste exhibits excellent bond line thickness and adhesion. Argomax 2148 gives excellent performance on marginal component surfaces. The resulting sintered joint provides high thermal and electrical conductivity. With its firm attachment to the inverter, manufacturers benefit from superior component performance and reliability in extreme temperature ranges.
Ease-of-use and application are key values associated with the Argomax product line. Argomax 2148 is the ideal choice for components where a low-pressure application is critical.
Major automotive manufacturers worldwide rely on the superior performance and reliability of Argomax as part of their electric vehicle inverters. The result: enhanced range, power, and reliability of electric vehicles, coupled with MacDermid Alpha’s unrivaled technical support and customer service.
Suggested Items
CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
08/29/2024 | TrendForceTrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025.
DRAM Industry Revenue Surges 24.8% in 2Q24, Upward Revision of Contract Price Increase for Q3
08/15/2024 | TrendForceTrendForce’s latest findings reveal that the DRAM industry saw a significant revenue increase to US$22.9 billion in the second quarter of 2024—a QoQ growth of 24.8%.
Technology Adoption and the Role of Automation
07/30/2024 | Happy Holden, I-Connect007In a recent paper at the SMTA Pan Pacific Strategic Electronics Symposium 2024, Auburn University professors highlighted their findings from their 2023 “Smart Manufacturing Adoption Study” Technical Report 23-01. The paper emphasizes five points that are important for the adoption of advanced technologies.
Ventec Joins PCBAA in Support of U.S. PCB Manufacturing
07/23/2024 | Ventec International GroupVentec International Group has announced its membership of the Printed Circuit Board Association of America (PCBAA), supporting the organization’s dedication to promote the interests of PCB manufacturers and suppliers in the US.
The Big Picture: The Shift From China to Southeast Asia
07/16/2024 | Mehul Davé -- Column: The Big PictureThe forecast for PCB growth over the next 10 years is strong. As an indispensable interconnect electronics part, PCBs are currently in high demand for several industries and will be for the foreseeable future. As the PCB industry grows, a significant trend is the gradual relocation of manufacturing facilities from China to Southeast Asia. This shift is driven by several factors, including rising labor costs in China, trade tensions, and the need for diversification of supply chains.