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IPC APEX EXPO: Some Thoughts About Growth

05/16/2024 | Dan Feinberg, I-Connect007
After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.

Using AI to Redefine Productivity

05/15/2024 | Nolan Johnson, SMT007 Magazine
​​​​​Plato Systems, a machine perception company spun out of Stanford University, employs AI and video data to analyze and optimize the human component in manufacturing. Initially focused on semiconductors, Plato Systems has expanded into EMS manufacturing. Co-founder and CEO Amin Arbabian, along with product advisor Anders Holden and head of growth Luis Vidal, discuss their approach to changeover optimization and its impact on productivity in the industry. They’ve also included customer Raj Vora in the conversation.

Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point

05/14/2024 | Real Time with...IPC APEX EXPO
In an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.

DRAM Contract Prices for Q2 Adjusted to a 13–18% Increase

05/07/2024 | TrendForce
TrendForce’s latest forecasts reveal contract prices for DRAM in the second quarter are expected to increase by 13–18%, while NAND Flash contract prices have been adjusted to a 15–20% Only eMMC/UFS will be seeing a smaller price increase of about 10%.

Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs

05/07/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
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