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Budget-Friendly Solder Recovery from EVS and WittcoSales at the Del Mar Electronics & Mfg Show
April 13, 2023 | EVS InternationalEstimated reading time: Less than a minute
EVS International, the leader in solder recovery, announced plans to exhibit at the Del Mar Electronics & Manufacturing Show (DMEMS) 2022, scheduled to take place April 26-27, 2023 at the Del Mar Fairgrounds in San Diego, CA. WittcoSales, Inc. will showcase the EVS 500LF Solder Recovery System in Booths 413 and 415.
EVS continues to improve the performance of its solder recovery units, and the EVS 500LF is no exception. With improved performance plus a significant price reduction, everyone can enjoy the savings that EVS solder recovery systems can offer. The EVS500LF is designed to ensure that the maximum recovery is maintained throughout the life of the wave solder system. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross.
The EVS 500LF has the same footprint as a printer and is aimed at multiple markets. The customer with one lead wave and one lead-free wave, the customer who uses Nitrogen or wants to reduce their Nitrogen usage, the customer with selective solder pots who only removes small amounts of dross every hour or the customer with multiple waves where one EVS 500LF is connected to each wave.
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10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
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Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.