Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
Marcy’s Musings: Advancing the Advanced Materials Discussion
The Marketing Minute: Cracking the Code of Technical Marketing
Call-for-Participation Webinar Board-Level Optical Interconnect Performance in Immersion-Cooled Environments
April 24, 2023 | iNEMIEstimated reading time: Less than a minute
Join us April 25 to learn about iNEMI’s new Board-Level Optical Interconnect Performance in Immersion-Cooled Environments project. Immersion cooling is gaining traction as a means of disruptive thermal management in high-performance computing and data centers; however, there is insufficient understanding of how optical interconnect components will perform in immersion-cooled environments. This issue affects OEMs and companies involved with photonics integration, mid-board optics and co-packaged optics.
The objectives of this new project are to:
Investigate and evaluate different on-board optical components and interconnect solutions in different immersion-cooled environments including single phase and dual phase.
Understand how design factors of interconnect components affect performance in an immersion environment.
Registration
These sessions are open to industry; advance registration is required, visit iNEMI's website.
Session 1
April 25, 2023
10:15-11:00 a.m. CEST (Europe)
4:15-5:00 p.m. CST (China)
Session 2
April 25
10:00-11:00 a.m. EDT (US)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
09/09/2025 | Josh Casper -- Column: Smart AutomationLarge, irregular, or mechanically unique parts, often referred to as odd-form components, have never truly disappeared from electronics manufacturing. While many in the industry have been pursuing miniaturization, faster placement speeds, and higher-density PCBs, certain market sectors are moving in the opposite direction.
Talking with Tamara: Floor Planning Policies
09/04/2025 | Andy Shaughnessy, Design007 MagazineTamara Jovanovic is an electrical engineer with Masimo, a medical equipment manufacturer. She’s been designing PCBs for seven years and earned a master’s degree in electrical engineering in 2022. I asked Tamara to share her thoughts on floor planning—the challenges, techniques, and advice for designers setting up floor planning strategies.