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The Chemical Connection: Getting to Know Your Vendor

02/16/2024 | Don Ball -- Column: The Chemical Connection
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.

EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends

02/14/2024 | Pete Starkey, I-Connect007
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.

EIPC Winter Conference 2024, Day 1: A Grab-bag of Technical Topics

02/12/2024 | Pete Starkey, I-Connect007
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.

Trouble in Your Tank: Electrodeposition of Copper, Part 6

02/08/2024 | Michael Carano -- Column: Trouble in Your Tank
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.

High Density Packaging User Group Announces Shikoku Chemicals Corporation Membership

02/02/2024 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member. 
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