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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
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Yamaha Motor Launches New YRP10 Premium Printer
June 1, 2023 | Yamaha Robotics SMT SectionEstimated reading time: Less than a minute
Yamaha Robotics, SMT Section announced that the company will release the new solder paste printer YRP10 on August 1 of this year.
The YRP10 is a new premium printer that achieves high-speed, high-precision solder printing, fully automated setup changeovers, and also supports dual-lane production. The Company has achieved the highest level of printing accuracy in the industry with the adoption of the new-generation YR series platform with excellent rigidity, a 3S head with new squeegee, and stencil vacuum mechanism, and the optimization of printing conditions, etc. In addition, automation of setup changeovers, such as automatic push-up pins and stencil replacement, greatly reduces labor and human error when changing out products. Moreover, a dual-lane specification that enables completely independent operation for each lane can also be selected to flexibly support a wide variety of type of production.
Yamaha Motor has realized the ideal concept of a 1 STOP SMART SOLUTION by taking advantage of the company's strengths as a full-line up manufacturer of mounting equipment, including surface mounters, printers, dispensers, and inspection equipment. The Company promotes the Intelligent Factory system, which comprehensively realizes higher efficiency in the mounting process through smooth and advanced inter-equipment cooperation without black boxes.
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Rachael Temple - AlltematedSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.