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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4

07/15/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.

Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design

07/10/2025 | I-Connect007
In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.

TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development

07/09/2025 | The Test Connection Inc.
The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.

Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits

07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth Elektronik
Inherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.

The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application

07/02/2025 | Global Electronics Association
The Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
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