Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Metcal Introduces CV-IOT Gateway Module and Desktop Application
June 5, 2023 | MetcalEstimated reading time: 1 minute
METCAL, a leader in benchtop soldering systems, announces the release of their new CV-IOT Gateway Module and desktop application which enables operations management to collect advanced soldering data from every benchtop station on their network.
By connecting the CV-IOT gateway to a Metcal Connection Validation (CV) soldering system and a computer or network, operations can utilize information on every joint to improve process control and efficiency in the soldering process. A standard handheld barcode scanner can easily be added to the setup for board-level traceability.
Using the desktop application, managers can easily analyze the data collected by the system to evaluate operator efficiency, quality of solder joints, temperature and power profiles, and even the cartridges used (including geometries, part numbers, serial numbers, and lot codes) for each soldering process. Alerts can also be set up to notify managers in real-time when processes are not being followed or when there is a concern with a soldering station.
The information from each solder event is stored using a standard database structure, ensuring the data is compatible with standard database applications and is easily accessible by the software application.
To ensure data security, the CV-IOT module plugs directly into the CV unit and the computer or network only through a wired connection.
The CV-IOT is expected to be particularly crucial for manufacturers where maximizing process control and traceability is essential.
“CV-IOT makes real-time process control and traceability simple,” said Seerena Wright, Metcal Product Manager. “CV-IOT allows users to quickly see what is happening throughout their operation, and to easily spot spikes or dips in throughput, identify potential problems, and trace the source of solder joint faults.”
CV-IOT is compatible with all Metcal Connection Validation™ soldering systems. The CV-IOT desktop application requires Windows 10, Intel® Core™ i5 CPU or better, 2 GB of RAM, Intel® HD Graphics, at least 150 GB of storage, and Ethernet 10/100.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.