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June 2023 Issue of Design007 Magazine Available Now
June 8, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Top Design Challenges
In this month’s Design007 Magazine, we share the top PCB design challenges from a variety of viewpoints—PCB designers, fabricators and assembly providers. The three challenges most often cited by contributors revolve around DFM, communication, and data—all of which are interrelated. We think you’ll find this compilation of design challenges useful.
Wondering why there is a tortoise on the cover of this issue? Well, if you recall one of the most popular Aesop’s Fables, The Tortoise and the Hare, the slow and steady reptile beat his much faster opponent by taking his time and persevering. Judging from what our expert contributors have to say in this issue, many PCB design problems could be precluded if designers simply took their time. (Yes, designers even called themselves out for this faux pas!)
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/22/2023 | Nolan Johnson, I-Connect007This week has been chock full of news about upcoming trade shows and conferences. Clearly, the season is upon us. This week, I-Connect007 reported on PCB West in Santa Clara (often referred to as the show which kicks off trade show season) and the topic of artificial intelligence was everywhere. By the looks of it, not just at the conference, either. For months now, the mainstream media has been gobbling up all sorts of news about generative AI engines, painting the picture that we’ll all lose our jobs to these tools, while also reporting on situations where the results from AI have gotten progressively worse over time.
Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record
09/21/2023 | TrendForceFueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase.
Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process
09/21/2023 | Cadence Design Systems, Inc.Cadence Design Systems, Inc. announced it has expanded its design IP portfolio on TSMC’s 3nm (N3E) process—most notably with the addition of the flagship Cadence® 224G Long-Reach (224G-LR) SerDes PHY IP, which has achieved first-pass silicon success.
Connect the Dots: Best Practices for Prototyping
09/21/2023 | Matt Stevenson -- Column: Connect the DotsPCB prototyping is a critical juncture during an electronic device’s journey from concept to reality. Regardless of a project’s complexity, the process of transforming a design into a working board is often enlightening in terms of how a design can be improved before a PCB is ready for full production.
Cadence to Acquire Intrinsix Corporation from CEVA
09/20/2023 | Cadence Design Systems, Inc.Cadence Design Systems, Inc. and CEVA, Inc. announced that they have entered into a definitive agreement for Cadence to acquire Intrinsix Corporation, a wholly owned subsidiary of CEVA and a provider of design engineering solutions focused on the U.S. aerospace and defense industry.