Trouble in Your Tank: Understanding Interconnect Defects, Part 1
It’s Only Common Sense: Marketing Isn’t Fluff, It’s Ammunition
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
KP Performance Antennas Launches New Line of RET Antennas
June 9, 2023 | KP Performance AntennasEstimated reading time: 1 minute
KP Performance Antennas, an Infinite Electronics brand and a manufacturer of wireless network antennas, has announced the launch of a new line of remote electrical tilt (RET) antennas for wireless communication networks.
The new RET antennas are designed to provide enhanced network coverage and capacity while reducing maintenance costs. They are ideal for use in LTE, 5G and other cellular networks.
KP’s new RET antennas feature AISG 2.0 remote electrical tilt technology, available in 2° to 12° or 0° to 10° options, that allows for precise antenna adjustments. With this capability, network operators can adjust the tilt of the antenna remotely. This helps to optimize the coverage and capacity of the network, which is particularly useful in areas with varying terrain or high interference. Being able to remotely control the coverage also enables antenna adjustments without costly tower climbs or network downtime.
The RET antennas have options for two, four or six connector ports. This allows for multiple frequencies to be covered with one antenna and reduces the need for additional hardware.
The new antennas have 4.3-10 female connectors and offer low passive intermodulation, ensuring that the signal quality remains high and stable.
Additionally, KP’s RET antennas are designed to cover global 5G bands in 1710-2690 MHz or 694-960 MHz omni, making them ideal for use in a wide range of applications.
“Our new RET antennas offer real-time adjustments to the antenna's radiation pattern, enabling network operators to optimize network performance. These products can withstand harsh weather and offer high-gain performance, making them suitable for a wide range of applications,” said Kevin Hietpas, Antenna Product Line Manager.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).