Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Nolan’s Notes: Soldering Technologies
The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
September 15, 2023 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
Share on:
Suggested Items
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
Closing the Loop: iNEMI Workshop Addresses Circularity Challenges
12/09/2024 | Kelly Scanlon, IPC Lead Sustainability StrategistThe electronics industry faces increasing pressure from consumers and regulators to implement more circular design principles in their products. While some companies lead the way, many grapple with significant knowledge gaps. These include a lack of clear definitions for "circular economy" in the context of electronics, insufficient data, and inadequate training to apply circular principles effectively across product lifecycles. Additionally, there's a pressing need to understand the return on investment (ROI) and other potential incentives for implementing circular principles.
2024 IPC K-FEST: Shaping the Future of the Electronics Industry
12/06/2024 | IPCIPC K-FEST 2024, the 2nd annual IPC Korea Festival of Electronics Standards and Technology, was held in Seoul on October 29. The focus of this year’s event centered on the integration of Korea's technological leadership with international standards development.
The Training Connection Difference
12/04/2024 | Andy Shaughnessy, I-Connect007Bert Horner, president of The Test Connection, has recently launched The Training Connection, a new company that addresses critical training needs in test engineering and development. With a focus on essential methodologies like design for test (DFT) and IPC standards, the initiative promises to enhance the skills of professionals in the field. At PCB Carolina, Bert talked about the program, its positive reception, and the growing demand for practical, effective training solutions within the industry.