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An Image Library of SMT Defects Section 1: BGA PCB Defects, Plating
December 31, 1969 |Estimated reading time: 1 minute
These images of SMT defects and attributes were compiled by consultant Tom Clifford. They provide resources for training, quality control specs and standards, and research. Descriptions, provided below each image, do not necessarily define causality or severity, but serve as identification.
Section 1: BGA PCB Defects, Plating
Images in this section include damaged PCBs, double plating, mouse bites, missing pads, domes, and other defects. Scroll to the bottom of the article for a list of upcoming sections.
Figure 1. Mechanical damage, scuffed. Note that these three images are of the same damaged PCB: the lighting was different. Be careful with careless interpretations. Understand and standardize your lighting.
Figure 2. Double-plate. Annular step. Probable bad wetting.
Figure 3. Lump and Dimple. Watch for deeper and open V-I-P voids in adjacent pads.
Figure 4. Double-plate, annular step. Watch for loose metal fragments. Expect poor reliability.
Figure 5. Over-etch overhang. Watch for loose metal fragments. Expect poor solder-joint reliability.
Figure 6. The pad is missing.
Figure 7. Mechanical damage or process upset. Expect OK test, but very poor reliability.
Figure 8. Dimples, step plating. Expect poor reliability.
Figure 9. Over-etch, overhang. Watch for loose fragments of copper/gold.
Figure 10. Double-plate, mis-registration.
Figure 11. Plating upset. Check wettability.
Figure 12. Serious plating upset. Likely compromised solder joints. Check for wettability.
Figure 13. Extremely domed solder plating. This could have an effect on stencil printing.
Figure 14. Mousebites.
Figure 15. Over-etch overhang. Expect electrical failures related to loose metal particles. Also expect poor reliability.
Figure 16. Domed solder plating. Expect placement and stencil printing impacts.
Upcoming Defects Image Library Sections:
Section 2. BGA PCB Defects, External DamageSection 3. BGA PCB Defects, Via-in-padSection 4. BGA PCB Defects, Clearance, DimsSection 5. BGA PCB Defects, MaskSection 6. BGA PCB Defects, Metallic ContaminationSection 7. BGA PCB Defects, Non-metallic Contamination, FOD Section 8. BGA PWB-related Assy DefectsSection 9. BGA Assy X-sectionsSection 10. BGAs Re-balled Section 11. SMT Assy DefectsSection 12. SMT Assy, T-cycled CracksSection 13. SMT PWB Pads Section 14. PWB Vias, X-sections
Do you have images of solder-joint or other interconnect features or defects that you would want to share? Send them to Holly Collins at SMT, editorial@iconnect007.com. You must obtain permission to publish the photos and may not show proprietary or company-specific information on the images. We are particularly interested in images of advanced SMT assembly technologies and failure analyses, for future sections.
Post your electronics manufacturing, SMT-related material to the #SMT community on Twitter. Use the #SMT hashtag.