Pick-and-Place Takes Over More Functionalities: New Products

Estimated reading time: 9 minutes

— With changes in software, nozzles, drive systems, feeders, and other elements, pick-and-place systems can place bare die or LEDs, perform high-speed IC shooter functions, handle large connectors and other oddforms, etc. New products come from Siemens Electronics Assembly Systems, Count On Tools, Universal Instruments, Essemtec, MYDATA, Assembleon, and IPTE.Die-bonding and SMT Placement

The SIPLACE CA platform combines die placement from wafers with classic SMT placement technology in a single machine. With the SIPLACE CA, manufacturers eliminate special die bonding processes to populate products with modern bare dies (flip-chip, die-attach) at high speed on a single line. The SIPLACE CA processes flip-chips from wafers at high speeds together with passive components from reels. The system is based on the SIPLACE X-Series with additional SIPLACE wafer systems (SWS) as feeders. Other special features include a flip unit, special vision systems and the linear flux dip unit (LDU). With this equipment, each SIPLACE Speedstar CP 20 head is able to place up to 9,000 flip-chips or 6,000 die-attach components per hour in sizes ranging from 0.8 to 18.7 mm with an accuracy of ±10 µm. The SIPLACE wafer system can handle different wafers; the wafers are replaced automatically and the punch-out speed is programmable. Since the new process requires only one pass through the oven, there is less substrate warping, according to the company. Siemens Electronics Assembly Systems GmbH& Co. KG, www.siplace.com

MYDATA Hydra Replacement Nozzles and Consumables

The MYDATA range is compatible with the following machine types: TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19, and MY100 (SX/DX). The Hydra tool range includes the following nozzle types: H01 (white), H02 (yellow), H03 (red), H04 (blue), H05 (brown), and H06 (green). This tool range covers all components from 0201s to midsize ICs, as well as QFPs and BGAs. By using a more impact-resistant plastic, Hydra tools are durable, while maintaining the desired size specifications needed for high-speed placement of components. Hydra tools are available in standard packs of eight or individually. Each tool is marked with a colored imprint, including the nozzle type, for fast identification in the field. Count On Tool’s current technology for its products can be extended to special applications, such as custom engineered nozzles for odd-form components, based on customer specifications. Count On Tools Inc., www.cotinc.com

Line Software

The Linechart within the Dimensions line software suite is a performance-monitoring software module designed to increase utilization rates to over 90%. This new multi-vendor reporting software provides complete visibility into all production lines and quickly identifies factory inefficiencies. Linechart helps to maximize utilization by monitoring production lines and providing graphical feedback for several key performance indicators across Universal and non-Universal pick-and-place equipment. When productivity falls below acceptable levels, the deficiency is easily identified. Linechart displays data down to the feeder and nozzle level. Linechart tracks the five main key performance indicators (KPI): productivity, efficiency, component wastage, components-per-hour (CPH), and board counts. Each KPI is graphically displayed as a line, bar, or pareto chart and can be refined to group the data by day, week, month, machine, product; or head, nozzle, and feeder. Linechart is also built on a flexible architecture that allows for customization. This includes the ability to set statistical limits and parameters, such as mean and standard deviation, and plot trend averages to name a few. In addition, reports can be exported into any of the Microsoft Office tools or printed directly from within the software to provide critical factory production data to management. Universal Instruments, www.uic.com

MYDATA Midas Replacement Nozzles and Consumables

The MYDATA range is compatible with the following machine types: TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19, and MY100 (SX/DX). The Midas tool range includes the following nozzle types for fine-pitch components: C14, A12, A13, A14S, B12, A23, A24, and C23. Count On Tools also manufactures special Midas nozzles, such as Spring Suspended tools (A23S, A24S, C23S), MELF tools (A34, B34, B24, B23, C24), Flat Pipe tools (blade), Multi-Port tools, ESD Ceramic tools, Micro Thin tools and Gripper tools. This expanded tool range covers any type of component from QFPs to BGAs to 01005s. The company also offers other consumables, such as filters and grease, for the Midas mount-head tools. Count On Tools Inc., www.cotinc.com

Import Function for Irregular BGAs

Irregular BGA ball distances have made them difficult and time-consuming to describe and program for placement. The SIPLACE Vision Teaching Station can import the Intel design data directly. This avoids transmission errors and significantly reduces the time required to process irregular BGAs. Irregular BGA components have balls that are distributed over their surface at irregular pitches. In many instances, these variations are as small as a few µm. A wizard that interprets an image of such a BGA to define these pitch distances is not always correct when the pitch differences are so small. That is why in the past these components often had to be programmed individually and sometimes even described down to the individual ball level. This was the only way to make sure that each individual ball position (of up to several thousand) was accurately described. Hence, A function for the SIPLACE Vision Teach Station imports the design data and the X/Y coordinates for each ball directly into the SIPLACE Pro programming system. This prevents transcription errors and significantly speeds up the time required to describe irregular BGAs. Siemens, www.siplace.com

Job Sequence Optimizer

MYPlan version 4.1 includes a Job Sequence Optimizer algorithm that will calculate the best production sequence and changeover strategy, for any mix of products and batch sizes. The software eliminates unnecessary feeder movements while maintaining high uptime and throughput. The new module will automatically calculate an optimized job sequence, using an advanced optimization algorithm that considers machine speed and feeder loading effort. Jobs that are suitable to run together based on part commonality will be placed in family kits. Other jobs will be run separately, with different changeover strategies depending on batch size and priority. Prototypes, large batches, and variants of similar products are accommodated. MYPlan 4.1 is fully integrated with the material handling system MYLabel, and the automated storage solution SMD Tower. Machine operators are guided through the entire set-up process, supported by a fully automatic component delivery system. The production planner will have full visibility of material status and availability. MYDATA automation AB, www.mydata.com

IC Shooter

A-Series pick & place machines now place ICs at the same speed and accuracy as chip components using Twin Placement Robot (TPR). The TPR eliminates the need for the extra line balancers. A-Series systems can handle high-speed chip and IC shooting on a single platform, up to 111,000 components/hour (CPH) to IPC 9850 at 35 µm accuracy. Components can be picked from a front-side tape and/or tray feeder. The A-Series machines can be used when placing DRAM memory modules and other ICs. Assembléon, www.assembleon.com

Stick Feeder System

Siplace equipment used for automated placement of relays and connectors in bigger sizes requires stick magazines supplied into the placement machines through special feeder mechanisms. These new stick-feeder systems include the entire Siplace interface, and also improve the docking procedure on other placement equipment. The new IPTE stick-feeder system can be employed in combination with the extended X-table on the Siplace equipment. Minimum cycle times are 0.75 sec for a placement operation. A capable control allows for the simple and intuitive human operation via just four keys. Status messages on the two-line display also support the easy handling of the system. Special features such as secondary feeding help reduce idle times at stick-feeder exchanges. The feeder systems are provided turnkey-ready with all component-specific application tools and adaptations included. IPTE Factory Automation, www.ipte.com

LED Placement 

With new options and software functionalities, the SIPLACE systems can populate current and future generations of large-area backlight units (BLUs) with LEDs for use in larger television sets, PC monitors, and notebook screens. In combination with the SIPLACE 20 segment Collect and Place heads and the vision systems of the SIPLACE X-Series, today’s SIPLACE machines are already able to place many different sizes of LEDs with dimensions of up to 6 × 6 mm from tapes and other feeder modules in high densities and with high speeds. Using SIPLACE software, electronics manufacturers can respond to the rising diversity and frequent product changes in the BLU field by quickly switching placement programs, placement modes, transport modes, and feeder modules. In the future, the company's SIPLACE X placement machines will be able to handle and populate boards with lengths of 800 mm and more for the new generations of television backlight units. A high number of LEDs are placed — between 30 and 80 LEDs per BLU module and up to 17 BLU modules per board — using the rotating SIPLACE Collect & Place heads, which stay in their pick-up position and move their nozzles. For example, a SIPLACE X4 equipped with four 20-nozzle SIPLACE SpeedStar placement heads achieves a real placement performance of up to 90,000 LEDs per hour while being able to handle all popular LED sizes. Siemens, www.siplace.com.

Advanced Drive System

On the Paraquda SMD placement machine, the main drive system of the machine uses a belt drive with a high-resolution measuring system and a fast and reliable drive control system. The benefits include higher maximum speed, a longer life time, lower cost and easier maintenance of the belt drive. With this drive type, the assembly head of the Paraquda can be positioned much faster and the throughput is higher. The mass of the head assembly is relatively high, as well as the acceleration forces that occur. With such strains, a belt shows significantly less wear than a metal spindle. Also, a belt can be exchanged in the field more easily. Overshoot due to belt elongation can be reduced by appropriate dimensioning of the belt and the use of a real-time control system. The Paraquda features a high-speed bus and regulation system that can calculate the current location values immediately and readjust the position without delay. The placement head is mounted on an H-drive system. The X and Y axes are autonomous, which allows a dynamic travel path optimization. The Y-Axis is driven with AC servo motors on both sides. For the exact positioning and parallelism, linear measurement systems transmit the current position values to the machine control system. The built-in linear scales have a resolution in the micrometer range, which allows Paraquda to place ultra-fine-pitch and 01005s. The four placement axes of the pick-and-place head are arranged in a square so that it can pick two components at the same time, regardless of whether the feeders are in front, rear, left, or right. Each of the four placement spindles is independent of the others. Each has its own vertical and rotational drive. The latter sits directly on the rotation axis. This is why each axis can place the complete component spectrum from the smallest of chips to large QFPs and BGAs. The optimization software that optimizes the assembly sequence and minimizes the travel path always uses four equivalent resources. The Paraquda is four machines in one: a chip placer, a fine-pitch placer, a special component placer and a dispensing machine. In addition to the SMD mounting head, up to two dispensing valves can be integrated simultaneously. These can be used to dispense solder paste, adhesives, flux or other liquids. Dispensing of lines, curves or dots is possible. With this feature, a Paraquda can be a die bonder, an IGBT assembly machine or it can be used for hybrid technologies. Essemtec, www.essemtec.com

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