IPC APEX EXPO 2010: Exhibits Preview VI

Estimated reading time: 9 minutes

LAS VEGAS — IPC APEX EXPO is coming up April 6-9 at the Mandalay Bay Convention Center in Las Vegas. This preview includes jet printing from MYDATA, 3M electronics products, Protron’s PCB fab and NBS’s EMS offerings, stencils and services from Fine Line Stencil, nitrogen generation from On Site Gas, rework products from Martin and OK International, a diverse offering from Christopher Associates, AOI and SPI from CyberOptics, selective soldering from APS Novastar, and dross processing systems from EVS International.

MYDATA Will Introduce the Updated MY500 Jet Printing System

The MY500 is capable of balancing a pick-and-place line rated at 30,000 CPH. It now has a broadened supplier base of paste and surface mount adhesives (SMA) including AIM, Almit, Alpha, Senju, and Heraeus. New jobs on the jet printer can be set up in minutes based on CAD data only; changeover and last-minute revisions are also reportedly fast. Jet printing can address advanced electronics designs, such as dense and complex boards. The MY500 optimizes paste volume for each solder joint and compensates for any board warpage or stretching. MYDATA automation Inc., www.mydata.com, Booth 2225.

3M Will Demonstrate Products and Technologies

Eliminating the damage caused by static electricity, EMI and micro-contaminations requires a complete static control program. 3M provides a full range of packaging, workstation and instrumentation product solutions to help electronic products manufacturers develop and maintain complete ESD control programs. The Static Control product catalog from 3M Electronics Solutions Division features 140 pages of electrostatic discharge solutions and is available at www.3m.com/static. Embedded Capacitance Material (ECM) from 3M will also be on display. 3M ECM is a thin, high-performance laminate that can be embedded in PCBs and chip packages. The material reduces impedance on printed circuit boards, power bus noise, EMI and discrete capacitor count. It is used by engineers working on high-speed digital designs to solve noise issues early in the design process, increase usable board area, and improve reliability by reducing components. www.3Mcapacitance.com. In addition, representative from the Transportation product line will also be available to discuss 3M cover and carrier tape, designed to meet the growing challenges of packing and transporting smaller and thinner electrical and electronic devices. The 3M Electronic Solutions Division, www.3M.com/electronics, Booth 1465.

U.S. Based Protron Circuits Discusses PCB Fab

The company has operations in Redmond, WA and Tucson, AZ. This is Protron’s third year at APEX in Las Vegas. Prototron provides high-technology, quick-turn PCBs. The company maintains 98%+ performance in quality and delivery. Prototron Circuits, www.prototron.com, Booth 935.

Nordson DAGE to Exhibit X-ray Inspection System

XD7600NT100HP X-ray inspection with 100 nm (0.1 µm) feature recognition provides finite analysis in challenging inspection applications. Equipped with a 2.0M pixel digital imaging system, the XD7600NT100HP offers oblique angle viewing of up to 70° around any point of a 16 ×18″ (407 × 458 mm) inspection area without compromising magnification. The XD7600NT100HP combines the digital acquisition technology of the Nordson DAGE XiDAT 3.0 imaging system with ImageWizard software. It is configured with dual monitors for simultaneous viewing of the X-ray image and a full-screen display of the X-ray navigation map of the sample. The system is available with a high-power tube combining 10 W power and submicron feature recognition. The Nordson DAGE high-power NT tube retains submicron feature recognition at full power. The XD7600NT100HP can be equipped with computerized tomography (CT) option providing 3D modeling and volumetric measurement of solder joints, for critical applications such as stacked die, MEMS, package-in-package and package-on-package. Nordson DAGE is a unit of the Nordson Corporation, www.nordsondage.com, Booth 1625.

FINE LINE STENCIL Will Feature Stencils and Services

The UltraSlic FG solder paste stencil offers paste release below 0.5 surface area ratios. Using the latest stencil laser technology and Datum Alloys’ new Fine Grain stencil material, exclusively distributed by Ed Fagan Inc., UltraSlic FG stencils provide good aperture registration, higher performance, and lower cost than electroform. The company can make step stencils, and offers same day turnaround times. FINE LINE STENCIL’s engineering group provides Root Cause Analysis for printing issues. With its facility in Memphis, FINE LINE is able to offer same day service to its customers as late as 7 p.m. Additionally, with the company’s online tracking system, users can place orders and track shipments online. FINE LINE STENCIL, a division of FCT Assembly, www.finelinestencil.com, Booth 2317.

On Site Gas Systems to Highlight N-30 Nitrogen Generator at IPC APEX EXPO

On Site Gas Systems Inc., a designer and manufacturer of oxygen and nitrogen PSA and membrane gas generation systems, will highlight its N-30 nitrogen generator. The reportedly easily installed and maintained system features an unlimited supply of nitrogen at the required purity level, generated on site. A precision control system maintains purity levels, with troubleshooting diagnostics, maintenance schedules and operation diagrams. The generator features up to three purity levels and has a low air-to-nitrogen ratio. The fully automatic system begins producing nitrogen when downstream demand is sensed. The N-30 can be built to any specifications, and On Site can match its generators to any compression equipment for any application. On Site Gas Systems Inc., www.onesitegas.com, Booth 2137.

NBS to Highlight Its EMS Evolution

EMS provider NBS will showcase its portfolio of engineering and manufacturing services. Key NBS team members will be on hand to meet with visitors about NBS services including design, consultative technical advice and support. The company began in 1999 as a PCB layout service provider and has evolved into a full-service contract manufacturer, beginning in 2004. NBS has continued expanding their scope of services to include advanced supply chain logistics, custom products sourcing and a wide array of verification services. Test capabilities at the firm now include advanced AOI, automatic 2D and 3D X-ray, ICT, FCT, BIT and flying probe technologies. NBS also offers test program development, boundary scan development and test, fixture design and manufacturing and a range of diagnostic and rework services. The company operates three design centers in the U.S. and one in southeast Asia. NBS recently implemented an in-line radio frequency identification (RFID) system to provide full electronic product traceability. NBS, www.nbscorp.com, Booth 2141.

OK International Offers Training, Application, and Productivity Program for Soldering and Assembly

The APR-5000 XL/XLS Array Package Rework System enables simultaneous use of inner and outer preheaters, reducing rework cycle time. Lowered nozzle temperature protects the component under rework, reducing BGA lid temperatures. Also being showcased is the MRS-1000 Modular Rework System, a high-accuracy benchtop solution for processes requiring precise control such as the removal of delicate miniature SMT components. The MFR-1100 Series soldering systems have SmartHeat technology, which raises power output without using excessive tip temperatures. The MFR-1160 can be used with Metcal SSC Cartridges, and a tweezer handpiece turns the MFR System into a rework tool. The Metcal MX-5000 soldering, desoldering, and rework system is a high-performance machine for complex assembly challenges, using SmartHeat Technology to eliminate overshoot potential and maintain high productivity soldering and rework. It also incorporates a built-in digital power indication display for continuous operator feedback and consistent, quality solder joints. The Metcal system reportedly reduces training investment, extends application possibilities, and boosts productivity. OK International, www.okinternational.com, Booth 1482.

Christopher Associates Product Lineup for IPC APEX 2010

Christopher Associates will exhibit the latest solder paste inspection technology from Koh Young Technology, as well as advanced full color AOI from Marantz Electronics. Koki Company Ltd. will introduce a new lead-free alloy with high performance characteristics. Additionally, Koki will introduce several new solder paste formulations for package-on-package (PoP) applications.Other products to be exhibited include the Vacu-Nest substrate support system, a patented firm yet soft technology developed by Novatec S.A. Christopher Associates also will display its range of printed circuit fabrication products.Finally, Christopher will introduce the Japan Unix Unisonik 414R ultrasonic robotic soldering technology. The Unisonik is an enabling technology that allows fluxless soldering to materials such as glass, aluminum and molybdenum. It also is useful for advanced manufacturing processes requiring extreme cleanliness. Christopher Associates, www.christopherweb.com, Booth 1917.

MARTIN to Introduce Rework Systems 

MARTIN, a FINETECH company, will demonstrate various rework systems at the show. The Expert 10.6XL Rework System is a portable, cost-effective rework solution suited for repairing large, high-value PCBs. Benefits include an intuitive interface, process repeatability and semi-automated operation. The system includes a new hybrid under-heater and control unit in one housing. This hybrid platform combines infrared (IR) and convection heating technologies for board temperature uniformity and minimal temperature-based PCB distortion. The Reball 03.1 is a cost-effective, stand-alone reballing unit, capable of handling a range of BGAs, QFNs, and CSPs. Processes can be completed in as little as three minutes. The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain within a safe temperature zone. The Reball-03.1 consists of a control unit, BGA holder and frame set for different components. The accessories kit includes solder balls, flux pen, solder paste, hook, brush, tape, cutter and magnifier. MARTIN, a FINETECH company, http://www.martin-smt.de, Booth 638.

Automated Selective Soldering from APS Novastar

APS Novastar’s ESS selective soldering machines enable cost-effective and reproducible automated selective soldering. Designed for assemblers wanting to make the transition from manual or semi-automatic to automated selective soldering, the ESS machines provide an entry point in cost-effective, easy-to-operate options for short run, batch selective soldering applications. The ESS310 and ESS500 systems provide easy-to-operate, robust systems for batch processing of mixed technology boards that require selective soldering of through-hole components. The systems can perform single point, drag, mini-wave, or dip soldering. The machines include on-board flux, preheat, and omni-directional soldering, micro-controller and intuitive programming software. Off-line programming and photoscan software are also available. APS Novastar LLC, http://www.apsgold.com, Booth 749.

CyberOptics Will Introduce SPI and AOI systems

SE350 is the latest addition to CyberOptics’ 3D solder paste inspection (SPI) system portfolio. The SE350 design with CyberOptics calibration-free sensor technology offers low cost of ownership with no machine-to-machine variation across the production lines. Leveraging on the technology of SE500, this system inspects pad sizes down to 01005 component size. The QX500 AOI system uses a proprietary image acquisition system to perform high-speed inspection. The introduction of SIM enables the system to offer on-the-fly inspection. CyberOptics Corporation, www.cyberoptics.com, Booth 2271.

EVS International to Highlight EVS 9000 Solder Dross Recovery System at APEX 2010

The EVS 9000 is said to offer reliability, ease of operation, maintenance and environmental management, with a reduced footprint, advanced electronic controls, and integrated diagnostics. The EVS 9000 offers a capacity of 20 kg/40 lb, and can perform single-operation de-drossing of large wave soldering machines. Its integrated hopper makes rapid transfer of dross simpler and safer, and shortens de-drossing times by up to 70%. It prevents use of wave oils and dross reduction powders. The process uses heat and pressure inside a magnetized cylinder to separate and return pure solder into an ingot tray. The remainder of the material is automatically ejected down a sealed chute into a dross bucket. Recovered pure solder is exactly the same specification as the solder in the wave soldering pot. This has been authenticated by the solder manufacturers and confirmed by the International Tin Research Institute. EVS International, www.solderrecovery.com, Sono-Tek’s Booth 1783.

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