NEPCON Production & Support Exhibition and Conference and EtroniX Show Guide

Estimated reading time: 32 minutes

This year, NEPCON Production & Support Exhibition and Conference (formerly NEPCON West) will be joined by five key industry events to form EtroniX. A new six-shows-under-one-roof event, EtroniX will provide solutions for the entire electronics supply chain from design, advanced packaging and components, to supply chain management, test and production. The events that make up EtroniX include: dEsign Expo, MP International, e/manufacturing, EvaluTech, NEPCON Production & Support, and co-located WESCON Spring.

ExhibitionNEPCON Production & Support Exhibition and Conference and EtroniX (including the EvaluTech, e/manufacturing, dEsign Expo and MP International) are set for February 25 to March 1, 2001, at the Anaheim Convention Center in Anaheim, Calif.

The exhibits are open February 27 to March 1 and will feature the latest electronics production equipment, materials and services for electronics manufacturers, including: adhesives, electronics manufacturing services (EMS), fiber optics, printed circuit board (PCB) design tools, PCB production equipment, PCB materials, software and supplies, rework and repair, soldering equipment, test equipment, and more. Visitors can expect to find the latest technology on display from leading suppliers like 3M, Agilent Technologies, Amkor Technology, F&K Delvotech, GenRad, Fluke, Hewlett-Packard, IFS, Keithley, Kulicke & Soffa, National Instruments, Nicolet, Northwest Analytical, Palomar Technologies, Teradyne, and hundreds of others.

ConferencesAt the NEPCON Conference, February 25 to March 1, participants can hear key speakers from companies like Alcatel USA, Cisco Systems, DuPont Fluoroproducts, IBM, Loctite, Qualmark, SRT/GenRad and others. Topics include "Lead-free Solder Technology, Application and Selection"; "Solder Defects, Prevention and Rework for Wave, Reflow and Cleaning"; "Fine-pitch PCB Design for Manufacture and Assembly"; "Solder Joint Reliability of BGA, Flip Chip and Chip Scale Assemblies"; and more.

The ExtroniX Conference will convene from February 27 to March 1. Participants can choose from more than 100 solutions-oriented conference sessions where they will hear key speakers from companies like Alcatel USA, Boeing, Cadence, Cisco Systems, DuPont, IBM, Loctite, Lucent Technologies, Motorola, Northrop Grumman, Packard Hughes, Qualmark, Raytheon and others. Hot topics and future trends will be the focus with topics that include "Linux in Test Applications"; "Lead-free Solder Technology, Application & Selection"; "Trends, Applications and Advances in 3-D and Thin Packaging Technologies"; "Hardware/Software Co-design"; and "Collaborative Product Development using DFM, ESI, the Internet and the Supply Chain."

After growing larger than any freestanding test event, the test and inspection portion of NEPCON West has evolved into a show and conference of its own. The new EvaluTech Exhibition and Conference, February 25 to March 1, will feature a full range of automated electronics test equipment, vision systems, software and evaluation tools, and the latest education for test engineers and other electronics manufacturing professionals. The EvaluTech Conference will bring participants up to speed on hot topics and future trends with topics that include "Design for Testability and Boundary Scan (JTAG)"; "Built-in Self Test Methods and Practices"; "Linux in Test Applications"; "Test Strategies for High-density Packages"; "Fundamentals of Machine Vision"; and more.

A full range of supply chain management tools, enterprise solutions, information systems and cutting edge education will be on hand for electronics manufacturing professionals at the new e/manufacturing Expo and Conference, February 25 to March 1. At the e/manufacturing conference, attendees can hear from technical experts that include Agile, Need2Buy, NextDay.com and ROI Systems, among others. Some topics offered include: "Collaborative Product Development using DFM, ESI, the Internet and the Supply Chain"; "e-Business Architectures, Alternatives and Implementation"; "e-Commerce Strategies for Electronics Manufacturers: Effectively Managing Multiple Channels"; "eProduct Lifecycle Management: Harnessing the Power of Value Chain Integration"; and more.

e/manufacturing also will host a special Agile Luncheon featuring speaker Mark Angelo, director of industry development at Agile Software, on the topic of "Collaborative Manufacturing Commerce Solutions for e-Supply Chains."

A full range of automated design tools, software and the latest education will be on hand for design engineers and other electronics manufacturing professionals at the new dEsign Expo and Conference, February 25 to March 1. At the dEsign Conference, attendees can hear from technical experts that include speakers from Cadence, Lucent Technologies, Motorola and Northrop Grumman Electronic Systems, among others. Some topics offered include: "Hardware/Software Co-design"; "C++ as a Hardware Specification Language: Design Methodologies Under a Compiler Generator Environment"; "EMC Printed Circuit Board Design Considerations"; "Fiber Optic Interconnect: Design for Reliability"; "Design for Manufacturability"; and more.

MP International, February 25 to March 1, will bring packaging professionals and leading suppliers together at an all-new microelectronics packaging exhibition and conference. At the MP International Conference, attendees can hear from technical experts that include speakers from Boeing, Lucent, Motorola and Raytheon, among others. Topics include: "Trends, Applications and Advances in 3-D and Thin Packaging Technologies"; "Conductive Adhesive Applications in Advanced Packaging"; "Ball Grid Arrays for Aerospace Applications"; "The Future of Microelectronics and Photonics and the Role of Materials and Mechanics."

Press ConferencesAt the EtroniX show, there will be numerous press conferences presented from February 27 to March 1. These include:

Tuesday, February 27

• Minot Area Development Corp. (MADC) will highlight the results of the electronics labor availability analysis, which defines an attractive labor market in the Minot area for electronics manufacturing from 10 to 11 a.m. in AR1B.
• Paralec will discuss two new products in the Parmod product line from 11 a.m. to 12 p.m. at Booth 8401. The products are designed for radio frequency antenna and membrane touch switch applications. The ink-and-paste products can be printed and cured to pure metallic conductors in seconds at temperatures low enough to be used on polymer circuit substrates.
• VXI Technology will unveil approximately 10 modular test solutions that combine their products with specialized products from other manufacturers for dedicated applications, such as medical, automotive, avionics, wireless and optical. This will take place from 12 to 1 p.m. at Booth 12015.
• Valor Computerized Systems will announce advances in the Trilogy 5000 Engineering System for assembly and test from 1 to 2 p.m. in AR1B.
• GenRad will present a press conference from 2 to 3 p.m. in AR1B.
• Geotest-Marvin Test Systems will announce the release of ATEasy 3.0, a software development environment for test professionals to create and maintain instrument drivers or complex test programs from 3 to 4 p.m. in AR1B.
• Loctite will announce their relationship with Multicore Solders from 5 to 6 p.m. in AR1B.

Wednesday, February 28

• Zierick Manufacturing Corp. will introduce the new Pin-Shooter SMT bowl feeder from 7:30 to 9 a.m. at Booth 4034.
• REC Singapore will present a press conference from 8:30 to 10 a.m. in AR1B.
• Northwest Analytical will introduce Windows-based workstation software for plant floor statistical process control (SPC), providing manufacturers with powerful and configurable software in an off-the-shelf package. This presentation will be from 11 a.m. to 12 p.m. in AR1B.
• Microscan will demonstrate new features of Quadrus 3.0, the company's fully integrated two-dimensional code reader from 12 to 1 p.m. in AR1B.
• International Test Technologies will present "How Partnerships Are the Key to Success in Providing Customers with the Complete Test Solution" from 1 to 2 p.m. in AR1B.
• Phoenix X-Ray Systems and Services Inc. will present the following topics: company overview; product philosophy; new product presentation; summary of a product palette; and future developments from 2 to 3 p.m. in AR1B.
• National Instruments/Agilent will show how leading test industry manufacturers are working alongside end-users to achieve instrument interchangeability from 3 to 5 p.m. in AR1B.
• Acculogic will announce the release of the TracerMDA, a PC-based board tester from 4 to 5 p.m. in AR1B.

Thursday, March 1

• Air Liquide America will introduce ALOX SMD-Dry and ALIX CON2SULTANT from 10 to 11 a.m. in AR1B.

KeynotesParticipants can take in free keynote addresses each morning of the show. On Tuesday, Celestica Senior Vice President of Corporate Strategies, Arthur P. Cimento, offers an in-depth look at the role of EMS companies in the electronics industry.

On Wednesday, futurist and best-selling author Watts Wacker forecasts the challenges and opportunities of the future and helps viewers prepare to meet them.

On Thursday, former NASA engineer and best-selling author Homer H. Hickam, Jr. translates his inspirational journey from the coal mines of West Virginia to the heart of NASA into valuable tools for success.

Special EventsSeveral special events take place each day at EtroniX, including:

• Lead-free Symposium: Materials and Processes. Chairpersons: Peter Biocca of Multicore Solders Inc. and Sammy Shina of University of Massachusetts-Lowell.
• Advanced Packaging Symposium: Critical Issues of Wafer-level Chip Scale Packaging (WLCSP), Chairman: John Lau of Agilent Technologies Inc.
• Executive Forum for the EMS Industry: Contractors, OEMs and Suppliers, presented by Technology Forecasters Inc.
• Focused Symposia on the Communications Network Interconnection Applications & Standards, presented by International Institute of Connector and Interconnection Technology Inc. (IICIT).
• SMTA Meeting, Luncheon and Technical Presentation: "Telecom Revolutions: The Internet, Bluetooth and Photonics" with speaker Dr. Ken Gilleo of Cookson Electronics.
• ASTE Member Meeting.

AwardsEtroniX also hosts several prestigious awards including The Best in Test Awards, sponsored by Test and Measurement World; the 10th Annual Excellence Awards, sponsored by EP&P; and the Service Excellence Awards (SEA), sponsored by Circuits Assembly and Technology Forecasters Inc.

NEPCON Production & Support and EtroniX 2001 are produced and managed by the Electronics Group of Reed Exhibition Companies (REC), which also produces NEPCON East/Electro, June 12 to 13, 2001, in Boston Mass.; and NEPCON Texas, November 14 to 15, 2001, in Dallas, Texas.

For more information about EtroniX or other electronics events, contact customer service at 383 Main Ave., Norwalk, Conn. 06851; (203) 840-5656; Web site: www.etronixexpo.com.

___________________________

EtroniX 2001: Electronics Manufacturing "Rockets" Into Cyberspace

ANAHEIM, Calif. EtroniX 2001 is the most advanced format in a trade show to evolve in many years. It pushes the trade show envelope by encompassing NEPCON West and five additional trade expositions. It is a new concept that Ken Boyd, director of industry marketing for ROI Systems, feels will advance the electronics trade show format into the true digital age and beyond a concept that he hopes his previous involvement as a conductor of technical sessions since 1998 with the NEPCON West shows helped to bring about.

At EtroniX 2001, Boyd again will present the latest tips and techniques for handling all aspects of electronics business. This will be presented in two conferences. In 1998 and 1999, the idea of e-business and total supply chain management was very unique, and to many manufacturers today, it still is. However, those who attended the previous sessions will not be disappointed because this subject matter is always fresh and stimulating. To be effective, it continually has to evolve one step ahead of the current status quo if it is to be of true benefit to the industry.

The two sessions will be held within the auspices of the e/Manufacturing Expo segment of EtroniX. "e-Product Lifecycle Management, Harnessing the Power of Value Chain Integration" is a full technical session in which Boyd will act as both the chairperson and presenter. The session will focus on using information technology to transfer relevant knowledge to streamline and compress the design and manufacturing cycle.

"Everything in electronics is about speed," said Boyd. "But to get that speed, you have to be able to do things right and get the information to the people who need it, when they need it. That's where our topics enter into it because we cover the latest trends of e-business, integrated design management, collaboration across the value chain, e-procurement, time-to-market and the integration of company-to-company information. Every topic has an e-business perspective to it. But the session is designed to help people handle their business in both the traditional areas and across the Internet."

Innovation and speed are the two crucial elements of the product lifecycle. Almost unanimously, electronics manufacturers believe that product lifecycles must be reduced now more than ever. They also must manage technical and market risk, and shift from monolithic "mega projects" to incremental product development and lifecycle management. New products must be introduced in less than six to 12 months while simultaneously decreasing total product development costs and resources by 50 percent or more.

In the current high-tech business environment, product development and lifecycle management are a team effort, integrating manufacturing, sales, marketing, quality assurance, customers, purchasing, suppliers, finance, logistics and service with engineering. To accelerate the product lifecycle and revitalize the essential management disciplines for tracking a product from concept to design, production, delivery, service, upgrade and revisions are critical business processes that must be redesigned, integrated and automated.

This technical course will provide an overview of solutions including enterprise resource planning (ERP), product change collaboration (PCC), integrated design management (IDM), Web-based supply chain business-to-business integration (B2Bi), B2B trading exchanges and e-collaborative manufacturing. Roadmaps and case studies will be presented for illustrative purposes.

Boyd will chair the session and present the topic "e-Business Trends and Directions." The other participants include Anand Ayyar, president of AimaSoft, who will discuss "Design Management Across the Supply Chain" and Sharone Zehavi from Global Factory who will speak on "Collaboration Across the Supply Chain." Steve McGill, VP trade partners from Need2Buy.com, will cover "e-Procurement, Productivity and Time-to-Market" and Ben Brimhall from webMethods will present "Integration and Standards in High-tech Manufacturing." The session will be held on February 27, 2001, from 9 a.m. to 12 p.m.

"This session has been unique because it is the only one that has ever really focused on this kind of business process management in electronics manufacturing instead of focusing on the traditional production line process management soldering, fabrication and areas of that nature. Traditionally, those types of topics are what seminars, conferences and technical sessions have been at NEPCON and most other electronics production trade shows," said Boyd. "This really has a different focus and it fits right in line with the changes that have been planned for the EtroniX conference this year."

"Quick Response Manufacturing (QRM): Cost and Cycle-time Reduction Across the Value Chain" is the second session Boyd will present. This is a seminar dedicated to eliminating non-value-added (NVA) activities within any company. Boyd states that recent studies indicate more than 90 percent of manufacturers rate QRM as strategically important but also indicate that more than 95 percent of company processes are NVA. These result in waste, rework, scrap and excessive queue-time. NVA activities increase cost, decrease quality and reduce possible competitive time advantages.

This session will expound on the techniques and technologies that can be used to facilitate QRM, cross-functional collaboration and communication, and reduced cycle time. Additionally, the session will provide an overview of the how and where to apply ERP, product data management, workflow and other information technologies and techniques.

QRM strategies can be used to pursue lead-time and cycle-time reduction in all areas of the business including engineering, manufacturing and the office environment. This session will review current information technology that can promote relevant knowledge transfer to streamline and compress design, manufacturing and office cycle times, sharing and transferring knowledge to those who need it when they need it, automatically. Discussions and case studies will be used that promote information integration and communication between all development and manufacturing chain members, and to illustrate the steps to achieving practical and successful enterprise-wide collaboration and the practical, realistic improvements, such as cost reductions that can be achieved.

The benefits gained from this seminar relate to most manufacturers. It is broad-based and not specific to any section or level of the electronics market. It covers the full product lifecycle and encompasses the entire value chain, from supplier to manufacturer to customer.

Any member of the electronics manufacturing process, from CEO to production engineering management, and all titles between, will take something of real value away from both these sessions; knowledge that can be put into action immediately to help support a healthy bottom line.

Boyd stated that he believes EtroniX will be the largest gathering of people in the electronics industry and will present a tremendous change in the approach from that of past trade shows.

He said that there really is no single source that manufacturers can rely on to help them move in the direction of effective e-Business techniques. There are many places to look for help, but that takes time that most manufacturers do not have. This type of technical session and the ensuing seminars are an effective place to review several proven strategies in one place and bounce questions and concerns off experts in various aspects of the latest techniques and technologies.

KEN BOYD, director of industry marketing, can be contacted at ROI Systems Inc. 435 Ford Rd., Suite 700, Minneapolis, MN 55426; (952) 797-5483; E-mail: keb@roitoday.com.

___________________________

EtroniX 2001 Products

Corner Bond AdhesiveCornerBond 3515, designed to minimize the effect of induced stresses between the PCB and the array package, is a single component liquid epoxy adhesive with a relatively high curing temperature to allow cure during the reflow solder process and self-alignment of surface mount components prior to adhesive fixturing. The thixotropic characteristics and de-aerated condition of this underfill are said to make it suitable for SMT dispensing with excellent drop shape control. Loctite Corp., Rocky Hill, Conn.

High-temperature Masking TapeScapa 581 is a pressure-sensitive adhesive plating tape designed to protect PCBs from damage caused by harsh chemicals during the plating and stripping of gold finger contacts and other chemical processing steps. The high-strength polyester backing reportedly is suitable for use with automatic taping machines, and the tape's blue color provides easy tape edge visibility. The product is said to be highly conformable and offer good adhesion, yet remove cleanly after processing without leaving a residue. Scapa Tapes, Windsor, Conn.

Combination Bonding/Rework SystemThe company will feature the Model 850 flip chip bonder equipped with the new Model 870 attachment for removing flip chips that have been bonded using the new reworkable underfill material. The bonder is designed for process development and low-volume production runs requiring ±12 µm placement accuracy of flip chips, chip scale devices, and bare die on circuit boards and flex circuits. The Model 870 attachment option includes a focused chip heat source for spot heating. Semiconductor Equipment Co., Moorpark, Calif.

Hand-held Inspection StationInspectaCam IC-500 video inspection system attempts to combine the comfort of video inspection with the convenience of hand-held versatility to inspect objects not easily accessible using conventional microscope inspection. Features of the camera include self-illumination, fingertip focus magnification range from 10 to 30X, a high-resolution 14" monitor and quick detach camera stand. Optional PC/video interface package enables capture of high-resolution video image to desktop computers. SMG Enterprises, Twain Harte, Calif.

Black Curing CoatingThis black, solvent-free, light curing conformal coating is said to cure faster than most clear UV coatings. The black color hides the board, components and circuitry. The coating has a secondary heat curing capability. This conformal coating is designed to dispense efficiently through precision dispensing systems, which reportedly improves the usage and placement of the coating. Cure is affected in seconds by exposure to longwave UV and visible light. This abrasion-resistant resin is designed to withstand harsh environmental conditions. According to the company, the coating exhibits adhesion to a variety of circuit boards, glass-filled epoxy, metal and ceramic surfaces. Dymax Corp., Torrington, Conn.

Dispensing SystemThe Auto-Tube System reportedly dispenses liquids, pastes, oils and grease directly from the manufacturer's tube or cartridge. The tube is screwed into a special adapter and placed inside the retaining cartridge assembly. According to the company, there is no need to transfer liquids and adhesives into syringes. The liquid-filled tube is placed directly into the system retainer and either a foot valve or a timed dispenser controls dispensing. The system can be hand-held, mounted on a stand, or used with the I&J500-LN, I&J750-LN or "SCARA" programmable XYZ dispensing systems. Three sizes are available: 100 gm tube, 200 gm tube and 1/10 gallon container. I&J Fisnar, Fair Lawn, N.J.

Microstamping, Pump DispenserReportedly ideal for conductive epoxy dispensing in applications with very fine deposition is the new combination of microstamping with traditional positive displacement pump dispensing. The system is said to dispense deposits down to 0.005". The system's two heads can be configured with either two positive displacement dispense pumps or with one dispense pump head and one stamp head. The positive dispense pump can dispense accurate individual dots, lines and areas at production rates, the company says. MRSI, North Billerica, Mass.

Dual Purpose LabelDesigned for use in the identification of PCBs and other related electronic components, this thermal transfer printable label reportedly provides a dual-purpose labeling solution for use in high-temperature wire marking applications as well as PCBs. The label uses proprietary topcoat chemistry that is said to more actively resist solder balls. The white matte topcoat is designed specifically for THT printing and maintains resistance to harsh fluxing and molten wavesolder environments found in mixed-board processes. According to the company, the label's thin profile is suitable for very fine microelectronic components with limited space requirements. Brady Worldwide Inc., Identification Solutions Div., Anaheim, Calif.

ESD Static SensorThe 718 static sensor and 718A Air Ionizer Test Kit are designed to work together to control electrostatic buildup in ESD environments. Measuring voltages up to 20,000 kV on surfaces, this sensor is said to read accurately up to ±5 percent of full measurement scale from a 1" distance. The sensor's plastic housing is conductive and reportedly allows a properly grounded user to dissipate all electrostatic charges from the surface of the meter. The unit features a field-sensing element in the front that picks up static electricity generated by an electrostatic charge on an object or surface. The air ionizer is a separate unit used to verify air ionizer performance and measure static charge neutralization. 3M Co., Austin, Texas.

Potting/Casting EpoxyThis line of potting and casting epoxies reportedly offers a 1:1 mixing ratio, suitable for production and automatic dispensing convenience. The ELC-316 line of epoxies is designated as a room temperature cure material, achieving full cure within 24 hours at 72°F, or cured within three hours at 130°F, according to the company. The RTV silicone line is said to be flame retardant, general purpose and reversion resistant. The reported curing time is within 24 hours at room temperature, or as fast as 15 minutes at 120°C. Electro-Lite Corp., Danbury, Conn.

Hot Bar Assembly StationThe 5200 Series hot bar systems combine high-precision bonding and display testing for assembling LCD modules with flex circuit or hot seal connectors to FR4 circuit boards. Designed for high production environments, the series includes closed-loop pulsed heat bonding capability, post-assembly testing of LCD modules and is available in three size configurations. This hot bar bonding station reportedly improves productivity, product yields and quality. The system combines several assembly operations into a single workstation. MicroJoin Inc., Poway, Calif.

Micro SandblasterThe Swam Blast line of precision micro sandblasting equipment is said to safely and selectively remove conformal coatings, solder mask, oxidation, component demarking, deflashing, PCB rework and repair, surface preparation, and texturing. Manual to automatic systems and Job Shop services are available. Crystal Mark Inc., Glendale, Calif.

Advanced Rework SystemsThe Summit LX series of rework systems reportedly are designed "from the ground up" specifically for reworking large format boards and backplanes. The LX series reportedly is optimized for PCB assemblies up to 24 x 36". Features include user-friendly controls, high-energy heating capacity and greater bottom area coverage, an enlarged frame and board support table, and a motorized top heater Z-axis. According to the company, the system is capable of removing and replacing BGAs and CCGAs, small CSPs, flip chips, and fine-pitch components. SRT, Westford, Mass.

Web Architecture SoftwareThis new Web architecture software is designed for OEMs, CMs and component suppliers. According to the company, this software enhances the product functionality. The improved performance reportedly delivers easy integration, improved response time, flexible reporting capabilities and increased security. A demo of the product will be available at EtroniX. PolyDyne Software, Austin, Texas.

Conductive AdhesivThis silver-filled epoxy, designated ABLEBOND 8177, is an electrically conductive adhesive said to cure in four minutes at 130°C. The rapid curing rate at low temperatures reportedly makes this epoxy useful with thermally sensitive devices. With a thermal conductivity of 3 W/m°K and low ionic content, the epoxy is suitable for bonding hot devices to a variety of substrates. This adhesive is available pre-mixed and frozen in syringe format for use in a dispense system. Emerson & Cuming, Billerica, Mass.

Fast Curing UnderfillThis one-component, high-purity, fast cure, semiconductor grade epoxy system is designed for the underfill encapsulation of flip chip devices. With a cure time of 15 minutes at 165°C, the ME-526 reportedly reduces stress between the substrate and solder bumps by keeping the solder bumps in a constant state of compression. The underfill has a low viscosity and rapidly flows under devices with stand-offs down to 0.001". The low coefficient of thermal expansion closely matches that of the solder bumps and minimizes the possibility of cracking during temperature shock and cycling testing. Thermoset, Lord Chemical Products, Indianapolis, Ind.

Multi-purpose HandlerThe Fast-Track All-in-One handler reportedly is a multi-purpose device handler for tray or tape input/output, programming capabilities, 3-D vision inspection, and laser marking. According to the company, the system is useful in high-volume pick-and-place handling. The machine is designed with two pick-and-place gantry assemblies, each of which can handle two devices at a time for higher units per hour rates. The laser marking system marks "good" devices in tray, thus requiring no tooling. Exatron, San Jose, Calif.

Vision Inspection SystemThe company claims the RTI-7500 is the most progressive in-line, high-speed vision inspection system to date. Using high-resolution cameras to check solder joints and verify part installation, the system's color mega-pixel camera reportedly extracts triple the amount of information of a gray-scale system. The inspection system is capable of accommodating up to 18 x 20" PCBs, is designed to be ergonomic and features self-learning programmability. CR Technology, Aliso Viejo, Calif.

Solder Sphere PreformsSolderQuick BGA preforms with lead-free solder spheres are available in 0.020, 0.025 and 0.030" ball diameters. These preforms reportedly are an improved method of attaching solder spheres to BGA components. An array of solder spheres that mirrors the array of the BGA is embedded in a water-soluble paper/ polymer carrier. Flux is applied to the component and is placed on top of the preform. According to the company, the process takes only a few seconds and requires minimal operator skill. Winslow Automation Inc., San Jose, Calif.

Selective Soldering SystemThe HARMONY Selective Soldering System is a high-productivity robot that can solder through-hole components. The system's Gaussian solder wave is bell-shaped and perpendicular, reportedly allowing the target to be soldered to approach the wave from any direction. Designed for SMT PCBs and other panels, the system shares a large common solder reservoir with multiple solder pumps that may be raised and lowered under software command. Each solder pump is a separate stand-alone unit that can be customized. Robotic Process Systems, Liberty Lake, Wash.

Vision Inspection SystemThe company claims the RTI-7500 is the most progressive in-line, high-speed vision inspection system to date. Using high-resolution cameras to check solder joints and verify part installation, the system's color mega-pixel camera reportedly extracts triple the amount of information of a gray-scale system. The inspection system is capable of accommodating up to 18 x 20" PCBs, is designed to be ergonomic and features self-learning programmability. CR Technology, Aliso Viejo, Calif.

___________________________

EtroniX 2001 Exhibitor List - Booth #

3M Co.

AA-B Lasers Inc. - P1792A.P.E. - P1658A.S.G., Div. of Jergens Inc. - P2087Abante Automation Inc. - T2343Above Board Electronics - P2186ABS-Vabsco Electronic Components Inc. - P2475Accu-Seal Corp. - P1119Acculogic Inc. - T2347ACL, Staticide - P1622crotech Southwest Inc. - P2074Adhesive Packaging Specialties Inc. TechFilm - P1583Advanced Integrated Technologies - P2488Advanced Manufacturing Online - P1179Advanced Packaging Magazine - P1190Advanced Techniques Co. Inc. - P1167Advantek Inc. - P2193AGA Chemicals Inc. - P1169Agilent Technologies - T2001AIM - P1674AIMCO - P1267Air-Vac Engineering Co. Inc. - P1741Akro-Mils - P2387American Hakko Products Inc. - P1375AmeriVacS LLC - P2275Amkor Technology - A4013Amtech Solder Co. AMT - A4019AOQC Moody International Inc. - P2375Apollo Seiko Ltd. - P1575APT Automation Inc. - P1183APW-Wright Line - P1659Aqueous Technologies - P1037Arizona Public Service - P2392ART (Advanced Research Technologies Inc.) - T2353Artos Engineering Co. - P2688ASSET InterTech Inc. - T2246Astronic - P2474Automated Packaging Systems Inc - A4236Automation Controls Group - P1777AutomationSolutions - P1701Aven Tools Inc. - P1691Avnet Tools & Test, Formerly Marshall Industries - P1123AZ-Com. Inc. - P2586

BBal Seal Engineering - P1266Baldor Electric Co. - P2281Ball Screws & Actuators - P2787Ball Screws & Actuators - P2789Basic Electronics Inc. - P1254BayStat, Bay Packaging Inc. - P2788Beam On Technology - P2276Beamworks Ltd. - T2652Bench-Craft Inc. - T2349BEVCO Ergonomic Seating - P2575BioFit Engineered Products - P1495Bismark-Mandan Development Assoc. - P1489Blue Light Industry USA Inc. - T2662Blue M. Electric - T2236Boedeker Plastics Inc. - P1697Bokar International Inc. - P1295BP Microsystems

CCab Technology Inc. - P1381Cabletest International - T2252Cahners Business Information - P1219Cahners Business Information - T2222Calmex Manufacturing Inc. - P2190Capco Plastics Inc. - P2588Cari-All - P1031Carpenter Manufacturing Co. Inc. - T2053CCB Electronics Corp. - P2090CCRCo. - T2559CGI Inc. - T2269CheckSum Inc. - T2059Chemtronics - P1523Chomerics, A Division of Parker Hannifin Corp. - P2486Ciba Specialty Chemicals - P1281Circuit Check Inc. - T2437Cirris Systems Corp. - T2628City of Anaheim - P1291City of Las Cruces - P2395CMI International - T2363Cogiscan Inc. - P2496Comco Inc. - P1559Comdisco Electronics Group - P1911Comm Con Connectors Inc. - P1747Compac Engineering Inc. - T2366Conceptronic Inc. - P1642Conductive Circuits Inc. - P1252Conductive Containers Inc. - P1809Connect2it LLC - T2523Connector Specifier Magazine - A4245Contact East Inc. - P1567Coreco Imaging Inc. - T2042Corelis Inc. - T2145CR Technology Inc. - T2637Creative Automation Co. - P2489Crystal Mark Inc. - A4115CST Inc. - T2226Current Inc. - P2583CyberOptics Corp. - P2374Cygnet Stamping & Fabrication - A4113

DDatapaq Inc. - P1387Datasweep Inc. - E4419Dazor Manufacturing Corp. - T2642Desco Charleswater - P1481Dexter Electronic Materials - A4219Digalog Systems Inc. - T2629Dispensing Technologies International Corp. - P2196DIT-MCO International - T2459Diversified Systems Inc. - P1053Dovebid - P1348Dow Corning Corp. - P1013DuPont Fluoroproducts - P1721Dymax Corp. - P1275Dynamic Details Inc. - P2095

EEasy Braid Co.

FF & K Delvotec Inc. - P1508Fancort Industries Inc. - P1558FeinFocus USA Inc. - T2543Fine Line Stencil - P1248FineTech - P1028Fischer Technology Inc. - T2131Fishman Corp. - P1274Flextek - P1619Flotron - P1568Fluke Corp. - T2658

GGary Plastic Packaging Corp. Stat Tech Div. - P1666GBP Ergonomics - P2777, P2295Genesis Industries Inc. - P1390GenRad Inc. - T2201Geotest Marvin Test Systems - T2701Glenbrook Technologies Inc. - T2568Glendo Corp. - P2197Global Automation Inc. - P2481Global Technologies - T2163Gordon Brush Manufacturing Co. Inc. - P1717Group ASE - P2391GTE Electronic Repair Services - T2755

HHamamatsu Corp. - T2147Hamilton Metalcraft Inc. - P1354Hanel Storage Systems - P1323Heidenhain Corp. - T2359Hepco Inc. - P1537Heraeus Inc. Cermalloy Div. - P1906Hi-Scope Systems Co. Win Systems of America Corp. - T2546Hiwin Mikrosystem - T2463Horizon Marketing Co. - P1810Huntron Inc. - T2553

II & J Fisnar Inc. - P2687I-Source Technical Services Inc. - P2698IAC Industries - P1629Ideal Industries Inc. - T2259Identco - P1500IFS Industrial & Financial Systems - E4401Igus Inc. - P1180IKO International Inc. - P1469IL/Norplex Inc. - P1081Imagenation - T2767Impell Purification Technologies Inc. - P2487Impressive Labels Inc. - P1490Indium Corp. of America - P1786, P1679Industrial Tools Inc. - A4208Inland Empire Economic Partnership (IEEP) - P1006Instron Corp. - P1590Insulation Supply Co. - P2377Intelligent Reasoning Systems Inc. - T2600Intellitech Corp. - T2667Interconnect Devices Inc. - T2237Interconnect Systems Inc. - P2183InterMetro Industries - T1901International Test Technologies - T2253Iwashita Instruments Inc. - P1249

JJ. A. Crawford Co. - P2682JTAG Technologies - T2552

KK Metal Products Inc. - P1286Keaco Inc. - P1186Keats Manufacturing Co. - T2228Keithley Instruments - T2329Kester Solder Co. Litton Industries - P1231Kewaunee Scientific Corp. TPG - P1586Key Tech - P2680Kinetek Corp. - A4045Kingsley Machinery - P1687Komax Corp. - P1337Kulicke & Soffa Industries - A4201Kyzen Corp. - A4212

LLakes Precision - P1563Lambda Technologies - P1026Leica Microsystems Inc. - A4124Liquid Control Corp. - A4012Lloyd's Register Quality - P2192Lost River Products Co. - P1682LR Environmental Equipment Co. Inc. - T2263Luxo Corp. - P1686

MM.G. Chemicals - P1579Mac Panel - T2346Mac Valves Distributor Inc. - T2469MagEyes - P2191Manix Manufacturing Inc. - P1431Manpower Inc. - P1069ManTech Test Systems Inc. - T2429Mapa Professional - P1393Mark Eyelet Inc. - A4006Marley Flexco - P2080Master Pack - P1155Maxclean Inc. - P2294McGraw-Hill - T2445Medallion Technology LLC - A4109Menke Marking Devices Inc. - P1790Mexico Trade Commission - P1019Micro Care Corp. - P1486Micro Control Co. - T2247Micro Motion Technology Corp. - P1793Micro Plastics - P1014MicroJoin Inc., A Palomar Technologies Co. - P1596Microscan Systems Inc. - T2342Mid-America Taping & Reeling Inc. - P2282Miller-Stephenson Chemical Co. Inc. - P2790Minco Technology Labs Inc. - A4232Minot Area Development Corp. (MADC) - P2678Mishiba Corp. of California

NNational Instruments - T2319National Wire & Cable Corp. - P1549New Mexico Business Quarters - P1195Newlong/Japan Rec. - P1000Nichimen Corp. - T2659Nikon Instruments Inc. - T2443Nix of America - P2593NMC Fastening Systems - P1914, P1915Nortek Automation - P1600North Alabama Industrial Development Association - P1391North Dakota Economic Development & Finance - T2121Northwest Analytical - E4418Novastar Technologies Inc., Automated Production Systems Inc. (APS) - P1319NSK Corp., Precision Products Div. - P1692

OO.C. White Co. - T2049OK International - P1643OKM - T2753Olamef, PEI - P1564Omni Training Corp. - P1731Orange County Business Council - P2093Orthodyne Electronics - P1636

PPace Inc. - P1419Packaging Aids Corp. - P1182Palomar Technologies - A4037Patlite Corp. - T2242Paxton Products Corp. - P1246Pec Lamp USA Corp. - P1258Pematech Rohwedder Inc. - T2037Petroferm Inc. - P1648Photo Stencil - P1242Plasma Etch Inc. - P2794Plastic Reel Corp. of America - P2587Plato Products Inc. - P2796Plexus Corp. - P1137Point Global Inc. - E4431Polaris Electronics Corp. - P2697Poly Systems USA Inc. - P1690Polydyne Development Corp. - E4424Polymer Flip Chip Corp. - A4121Pomona Electronics - T2660Practical Components Inc. - T2371Precision Extrusions Inc. - P2076Precision Micro Control Corp. - T2670Precision Valve & Automation Inc. - P1162PRF USA Inc. - T2800Pro Automation Inc. - P1004Pro-Line - P2397Production Basics - P2597Production Industries Inc. - P1359Puritan/PurSwab, Hardwood Products Co. LP - P1597PX Instrument Technology - T2709

QQ Corp. - T2012QA Technology Co. Inc. - T2529QRP Inc. - P2398Qualectron Systems Corp. - P2492Quantum Storage Systems - P2773

RR&D Circuits Inc. - P1253R-1 Source Inc. World Equipment Source - P1395Racal Instruments Inc. - T2027RadioShack.com - T2262Radoll Designs Inc. - P1796Raven Industries Inc. - P1259Reli-a-Flex - P2393Robotic Process Systems - P1475Ron Grob Co. - T2006Rossi Giovanni SNC - P1493Royonix Inc. - P1815RSF Electronics Inc. - P2293RSI, ID Technologies - P1187RTI - P2675RVSI - T2229

SS.P. Precision International - P1175Saki Corp. - T2666Samtec Inc. - P2187Sandvik Lindstrom - P1519ScanCAD International Inc. - P1727Scapa Tapes North America - T2721Schleuniger Inc. - P1453Schneeberger Inc. - P2287Scienscope International Inc. - T2125Scientific Technologies Inc. - P2292Scorpion Technologies - T2651,T2645Sea View Technologies Inc. - P1816Sealant Equipment & Engineering Inc. - A4137Seco Industries - P1449Semco Application Systems, PRC-DeSoto International - P1287Semiconductor Equipment Corp. - A4144, P1095Senior Systems Technology Inc. - P1773Sensbey Inc. Nihon Den-Netsu Keiki Co. Ltd. - P1651Shima American Corp. - P1087Showa Co. - P2278Siemens Energy & Automation Inc., Electronics Manufacturing Center - P1342SierraTherm Production Furnaces Inc. - P1811Sikama International Inc. - A4033Simco Static Control and Cleanroom Products - P1143Sipel - P1562Smart Sonic Stencil Cleaning Systems - P1713SmartMove Conveyors - P1147SMT Magazine - A4245Smurfit-Stone Container Corp. - P1232Soldering Technology International Inc. - P1547Sonix Inc. - T2533Sonora Manufacturing Group Enterprises - T2442Southwest Test Inc. - T2232ST Assembly Test Services Inc. (STATS) - A4224Standard Pneumatic & Electric Tool Co. - P1553Start International - P1529State Goverment of Baja California - P2691State of Colorado, Colorado Office of Business Development - P1676Static Control Components Inc. - P1678Static Technologies Corp. - P1646Statico - P1072Stevens Products Inc. - P1910Swanstrom Tools USA - P2491

TT-Tech Inc. - D4606Team California - T2167Tech Spray Inc. - P1543Techni-Tool Inc. - P1654Tek Stil Concepts Inc. - P2386Teledyne Electronic Technologies - A4000Ten North Software Inc. - T2067Tenney Environmental - T2542Teradyne, Assembly Test Div. - T2610Testing House - T2563Testronics - T2519Texmac Inc. - T2219Textron Fastening Systems - P2175Tharo Systems Inc. - P1618The Test Connection Inc. - T2636Thermoset, Lord Chemical Products - P1349Thermotron Industries - T2447Thomas Register of American Manufacturers - P1491Thomson Industries Inc. - T2537Thordarson - T2266, P1075Titan Spring and Wire Products - P2596Tomken Industries Inc. - P1292TopLine Dummy Components - P2577TÜV Product Service, TÜV Management Service - T2010

UUnit Design Inc. - P1628United Resin Corp - P1389Unitek Equipment - P1331Upgrade Technologies - P1463US Digitaltest Inc. - T2619

VV-Tek Inc. - P1775Vanier Manufacturing Inc. - P1487Vectron - T2061Virginia Panel Corp. - T2810Virtual Industries Inc. - P1262, P1282Vision Engineering Inc. - P1131Vision Technology Inc. - T2153Volt Services Group - T2648VPI - P2574VRS Marking - T2258VWR Scientific Products - P1392VXI Technology Inc. - T2159

WW.M. Berg Inc. - P2786Waldmann Lighting - P1459Wandel & Goltermann A.T.E. Systems Inc. - T2019Wayne Kerr Inc. - T2137Weetech Inc. - T2453Weller Cooper Tools - P1201Wera Tools Inc. - P2783Western Industrial Products, Division of Western Industrial Tooling Inc. - P2288Western Servo Design Inc. - P2274Westlake Plastics, Crystal-X Plastics - P2493Wiha Tools - T2267Will-Mann Inc. - P2781Winslow Automation Inc. - P1693Wittcosales Inc. - P2277Workstation Industrie - P1010World Test Systems Inc. - T2725

YY.C. Cable USA Inc. - T2547Yield Engineering - P1745

ZZebra Technologies Corp. - P1650Zephyrtronics - P2592Zero-Max Inc. - P2092Zestron Corp. - P2686Zippertubing Co. - P2693

Exhibitor list final as of press time.