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Flip Chip Calculator
December 31, 1969 |Estimated reading time: Less than a minute
The Flip Chip Calculator is a software application that is available at no cost on the company`s Web site. It reportedly offers a way to determine the volume of underfill necessary to optimize flip chip-in-package and flip COB dispensing processes. Users input parameters including die proportions, fillet width and solder-bump profiles, then select a specific underfill material from the range of industry-standard fluids included in the program. The materials list can be edited to accommodate additional fluids and their specifications. The software application reportedly analyzes the user-defined profile for volume tolerance, using die proportions and underfill material characteristics.
Asymtek, a Nordson Co.
Carlsbad, Calif.
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