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New demands on PCB fabrication, namely advanced packaging, ultra high density interconnect (UHDI), and new specialty materials, are converging, changing the landscape of our business. Is it time to start paying close attention to this convergence?
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3D Printed Electronics: When & How?
March 18, 2015 | Real Time with...IPCEstimated reading time: Less than a minute

Josh Goldberg, marketing specialist with Taiyo America, looks beyond fusion deposition modelling and considers what might be achievable in 3D printed circuit fabrication using UV curable materials and metallic powder laser sintering. If some real innovators take a serious interest, we could see results within five years.
Watch the interview here.
Suggested Items
Visit Dymax at SMTA International 2023 Discover Innovative Light-Cure Solutions for Today’s Electronics
09/21/2023 | DymaxDymax, a leading manufacturer of light-curing materials and equipment, will exhibit in booth 1526 at SMTA International 2023 in Minneapolis, MN, from October 10-11.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Rigid-flex Stackup: It’s a 3D World
09/20/2023 | Andy Shaughnessy, Design007Z-zero founder Bill Hargin has been studying stackup design techniques for years. He developed the company’s PCB stackup planning software, and he wrote an I-Connect007 eBook, The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design. In this interview, Bill shares his thoughts on designing rigid-flex stackups, the challenges they bring, and what rigid board designers need to know about designing stackups in 3D. “Flexperts” Mark Finstad of Flexible Circuit Technologies and Nick Koop of TTM Technologies also offer insight into the many tradeoffs that rigid-flex designers face.
Nolan's Notes: Convergence
09/19/2023 | Nolan Johnson -- Column: Nolan's NotesWhen I stop to consider the dynamics in our industry at this moment, I keep coming back to the idea of “convergence.” Aspects of our industry historically thought of as distinct and separate are blurring the lines and overlapping. As I look back on our coverage in the past five years, I see convergence taking place, moving like a glacier—slow and steady but with formidable force. In this issue of PCB007 Magazine, the three areas of convergence we consider are materials, advanced packaging, and UHDI.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?