Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
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3D Printed Electronics: When & How?
March 18, 2015 | Real Time with...IPCEstimated reading time: Less than a minute
Josh Goldberg, marketing specialist with Taiyo America, looks beyond fusion deposition modelling and considers what might be achievable in 3D printed circuit fabrication using UV curable materials and metallic powder laser sintering. If some real innovators take a serious interest, we could see results within five years.
Watch the interview here.
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