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Exact Science Implemented at Kester for Increased Reliablity
May 13, 2015 | Real Time with...IPCEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/7416/3116/5410/038-kester03.jpg)
Kester's Bruno Tolla and Dr. Yanrong Shi discuss with Guest Editor Steve Williams the importance of fully understanding their many solder formulations with respect to solderability and reliability, as related to customer needs and applications. With their fully equipped lab Kester's team can delve deeply into understanding the interactions of the chemistry involved, all of which can affect solderability performance.
To watch the interview, click here.
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Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers
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New Breakthrough in Double-Sided Reflow Part Retention from Alltemated
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Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 2
07/17/2024 | I-Connect007 Editorial TeamIn this chapter, we’ll focus on the most important analytics at the forefront of SMT, from the solder paste machine to placement machines, and breakdown these metrics from the perspectives of the different decision makers involved in the process. The lead SMT shift manager isn’t going to have the same concerns as a quality manager, so it’s important to look at how each machine and operation contains valuable KPIs for each role.
SMTA Heartland Chapter Announces Rescheduled Date for High Reliability: Virtual STAR Forum
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