-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
New IPC Report Details How PCB Makers Address Tech Trends
June 1, 2015 | IPCEstimated reading time: 2 minutes
PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.
Based on data collected from 158 companies worldwide, the 173-page PCB technology trends study presents the aggregate data segmented by application for five key segments: computers and telecommunications, consumer electronics, industrial and automotive electronics, medical electronics, and military and aerospace electronics.
The study covers such issues as: clock speed, heat dissipation, operation cycles, product life expectancy, environmental operating range, lamination cycles, board thickness, layer counts, line width and spacing, via diameters, aspect ratios, use of embedded technologies, surface-mount land dimensions, I/O pitch, test density, recyclable content, component size, and numbers of leads, solder joints and components per board area.
Among the many interesting findings, the study reports that nearly half of the responding PCB manufacturers for computer and telecommunications applications expect their highest clock speeds in 2019 to exceed 25 gigahertz. This segment had the highest clock speed predictions. The military and aerospace segment reported that heat dissipation is a design-limiting factor in half of their devices currently, which is the highest of the five applications studied, and they expect that percentage to rise in the next four years. More than one-third of responding companies in the military and aerospace segment are currently embedding passive components in their boards. Embedding of passive and active components is expected to increase substantially by 2019 for all five applications studied.
PCB Technology Trends 2014 is available free to companies that participated in the survey. Other companies may purchase the report by visiting IPC’s online store. The price for IPC members is $675 and $1,350 for nonmembers. For more information or to purchase the report, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,600 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).
Technica USA and Electra Polymers: Driving Success in Ink Jet Solder Mask Across North America
02/27/2025 | Technica USATechnica and Electra Polymers have achieved remarkable success in the ink jet solder mask market. Electra Polymers is the dominant force in North America, holding an overwhelming market share north of 80% with its ElectraJet® EMJ110 solder mask.