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Engineered Materials Systems Debuts New Conductive Adhesive
June 1, 2015 | Engineered Materials SystemsEstimated reading time: Less than a minute
Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-15 Adhesive. The room temperature cure two-part conductive adhesive has been designed for circuit assembly applications.
EMS 618-15 is designed to cure in 24-hours at room temperature or rapidly at elevated temperatures. The material has a ten-to-one mix ratio and is available in a two syringe packaging system designed for use with static mix heads. EMS 618-15 forms high strength, high reliability conductive interconnects.
The EMS 618-15 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive adhesives for circuit assembly applications.
For more information about the EMS 618-15 Room Temperature Cure Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
About Engineered Material Systems
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.
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