Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Indium’s Wisdom Qu to Present at SMTA China South Technical Conference

09/29/2023 | Indium Corporation
Indium Corporation Regional Product Manager Wisdom Qu will present at the SMTA China South Technical Conference, held in conjunction with NEPCON Asia, on October 11 in Shenzhen, China.

The End of Solder?

09/28/2023 | Nolan Johnson, I-Connect007
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.

ZESTRON to Present 'Revolutionizing PCB Assembly Cleaning' at SMTA International

09/28/2023 | ZESTRON
ZESTRON is happy to announce that Senior Application Engineer, Ravi Parthasarathy, will be presenting "Revolutionizing PCB Assembly Cleaning:

IPC Unveils New Training Courses and Subscription Model for the Electronics Workforce

09/28/2023 | IPC
IPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs.

Rigid-flex DFA

09/19/2023 | Andy Shaughnessy, Design007
Rigid-flex assembly brings its own set of issues, but designers can do quite a bit to make things easier on their downstream brethren. We asked IPC instructor Kris Moyer to give us the lowdown on DFA for rigid-flex circuitry.
Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in