Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
USI de Mexico S. A. de C.V. Selects VERSAFLOW 3/66 Dual Track
June 3, 2015 | Kurtz Ersa North AmericaEstimated reading time: 1 minute
Kurtz Ersa North America, a leading supplier of electronics production equipment, announces that it recently sold a new VERSAFLOW 3/66 selective soldering machine to Universal Scientific Industrial de Mexico (USI) S. A. de C.V. The system was installed and is in use at USI’s plant in Jalisco, Mexico.
USI purchased a dual conveyor unit with two fluxers and segmented top and bottom preheaters. Additionally, it has two solder modules and a total of four solder pots within the machine. Enrique Diaz, Industrial Manager, stated, “We chose ERSA because they are the only supplier in the market that offers dual conveyors. In addition to our excellent relationship with the ERSA team, they offer low maintenance costs, high performance and high quality yields close to 100 percent.”
The VERSAFLOW 3/66 is the world’s leading platform for selective soldering. The proven third generation technology offers the highest flexibility and highest volume throughput for PCBs sized up to 24" x 24". The use of high-precision servo gantry systems, electromagnetic pumping systems, dual solder pot capability, top- and bottom-side preheating capability, and modularity make ERSA the leader in selective soldering.
For more information about Universal Scientific Industrial de Mexico (USI) S. A. de C.V., visit www.usi.com.tw.
For more information about Kurtz Ersa North America, visit www.ersa.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.