-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
June 3, 2015 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
It seems that flex circuit technology is definitely coming into its own. The market for flex circuitry has always been growing, but now it is rapidly accelerating, with new technologies and new applications in the news nearly every day. Flex is not just in your laptop and camera anymore, it is in your car, in space, and on your body. In other words, flex is everywhere.
We originally intended this issue to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
Our cover story from OM Group discusses the processing of flex materials using a stress-free plating technology for both flex and rigid-flex materials.
Then, Dr. Joan Vrtis of Multek gives a great market overview of that relatively new industry most often called ‘wearables.’ She points out that wearables are not new, but when combined with electronics, this industry is only limited by the imagination, as the technology to make it happen is rapidly evolving.
Looking at another flex industry segment (flex segmented!), Maarten Cauwe and co-authors from imec pull our interest in a different direction as they explore two technologies for flexible and stretchable circuits in space applications.
So back to the beginning: Two articles discuss new materials to help make some of this happen. Panasonic’s Yoshioka et al., present a high-performance substrate for stretchable electronics, while Dupont’s Sidney Cox discusses a new flex material for high-temperature
applications.
Also on the topic of the processing of flex materials, Patrick Riechel of ESI reviews three technologies for microvia drilling and cutting. Rounding out the processing topic is columnist Todd Kolmodin with a brief overview on testing flex circuits.
This month is a perfect time to introduce our two newest columnists, who will become regular contributors to our Flex007 Weekly Newsletter that publishes every Thursday. As her first subject, Tara Dunn of Omni PCB chose “Flex-to-Fit”—another flex industry subset that is only limited by the imagination.
And last but not least, Dave Becker of All Flex presents his summary of wearable technology. There’s a lot going on in flexible, stretchable, wearable technology and there is much to learn!
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.