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Flexible, Stretchable, and Wearable: If You Can Dream it, You Can Create it!
June 3, 2015 | Patty Goldman, I-Connect007Estimated reading time: 2 minutes
It seems that flex circuit technology is definitely coming into its own. The market for flex circuitry has always been growing, but now it is rapidly accelerating, with new technologies and new applications in the news nearly every day. Flex is not just in your laptop and camera anymore, it is in your car, in space, and on your body. In other words, flex is everywhere.
We originally intended this issue to be centered on flexible circuits, but it quickly became apparent that we needed to broaden the scope and include all (well, at least some) of the new and exciting things going on these days in the world of flexible everything. As such, we have garnered a trove of authors, with much information to impart on the above mentioned.
Our cover story from OM Group discusses the processing of flex materials using a stress-free plating technology for both flex and rigid-flex materials.
Then, Dr. Joan Vrtis of Multek gives a great market overview of that relatively new industry most often called ‘wearables.’ She points out that wearables are not new, but when combined with electronics, this industry is only limited by the imagination, as the technology to make it happen is rapidly evolving.
Looking at another flex industry segment (flex segmented!), Maarten Cauwe and co-authors from imec pull our interest in a different direction as they explore two technologies for flexible and stretchable circuits in space applications.
So back to the beginning: Two articles discuss new materials to help make some of this happen. Panasonic’s Yoshioka et al., present a high-performance substrate for stretchable electronics, while Dupont’s Sidney Cox discusses a new flex material for high-temperature
applications.
Also on the topic of the processing of flex materials, Patrick Riechel of ESI reviews three technologies for microvia drilling and cutting. Rounding out the processing topic is columnist Todd Kolmodin with a brief overview on testing flex circuits.
This month is a perfect time to introduce our two newest columnists, who will become regular contributors to our Flex007 Weekly Newsletter that publishes every Thursday. As her first subject, Tara Dunn of Omni PCB chose “Flex-to-Fit”—another flex industry subset that is only limited by the imagination.
And last but not least, Dave Becker of All Flex presents his summary of wearable technology. There’s a lot going on in flexible, stretchable, wearable technology and there is much to learn!
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I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.
Simplifying Software Integration for Every Factory
10/22/2025 | Nolan Johnson, SMT007 MagazineAs a leading provider of factory digitalization solutions for electronics manufacturers, Cogiscan is at the heart of the software integration process. Davina McDonnell, director of marketing and product management, discusses how Cogiscan ensures that customers are ready to integrate and what it looks for to ensure a quick and appropriate installation.