The New Chapter: The Pros and Cons of Tribal Knowledge
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
The Chemical Connection: Don’t Just Blame the EtcherGraphic USA Adds PCB Veteran Frank Castro
June 18, 2015 | Graphic USAEstimated reading time: 1 minute
Frank Castro, a highly experienced and well regarded expert of the PCB Industry has joined Graphic USA, a global manufacturer of high-technology printed circuit boards. As Production Manager, Mr. Castro will oversee all of the manufacturing operations and processes of Graphic USA, with special emphasis on the engineering and manufacturing of Flex, Rigid Flex Circuits and Flex Heater products for the Medical, Military, Aerospace, Automotive and Consumer industries.
Most recently, Mr. Castro spent 12 years at Rigid Flex International where he also served as Production Manager and served many Southern California PCB Companies beginning with his early days at Hughes Aircraft (now Raytheon).
With the addition of Mr. Castro, Graphic USA continues on its path of long term investment in the US Market. With special expertise in the Flex Circuit and Rigid Flex Circuit Market, Graphic USA is able to offer the complete service from Application Engineering support to volume PCB manufacture. Graphic USA’s customers come from a wide range of industries including the Mil Aero, Medical and Commercial sectors.
Graphic USA is division of The Graphic Group, one of the most technically competent manufacturers of high-technology printed circuit boards. With headquarters in the UK and full service manufacturing facilities in the USA and China, The Graphic Group focuses on leading edge technology released to the most demanding international quality standards. HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind, buried, micro, copper and resin filled and stacked vias, sequential build-up, buried resistance and buried capacitance.
More Information can be found at www.graphic-usa.com and www.graphic.plc.uk,
Share on:
Suggested Items
UHDI Fundamentals: A Primer on UHDI
09/28/2023 | Anaya Vardya, American Standard CircuitsThere has always been pressure to reduce line and space as we have seen the bleeding edge technology go from 8 mils to 5 mils and then to 3 mils. The difference between “then” and “now” is that the prior advancements, for the most part, used the same processes, chemistry and equipment going from 8 mils to 3 mils. But going from 3 mil to sub 1 mil trace and space is a quantum leap in printed circuit board (PCB) technology that requires a whole new set of processes and materials.
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
09/28/2023 | Michael Carano -- Column: Trouble in Your TankIn a previous column, the critical process of desmear and its necessity to ensure a clean copper surface connection was presented. Now, my discussion will focus on obtaining a void-free and tightly adherent copper plating deposit on these surfaces. After the desmear process, the task is to insure a continuous, conductive, and void-free deposit on the via walls and capture pad. Today, there are several processes that can be utilized to render vias conductive.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Designer’s Notebook: DFM Principles for Flexible Circuits
09/14/2023 | Vern Solberg -- Column: Designer's NotebookFlexible circuit applications can be as basic as furnishing electrical interconnect between two conventional circuit board assemblies, or to prove a platform for placing and interconnecting electronic components. During the planning and pre-design phase of the flexible circuit, there will be several material and process related questions that need to be addressed. Most flexible circuit fabricators welcome the opportunity to discuss their customers’ flexible circuit objectives prior to beginning the actual design process.