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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Graphic USA Adds PCB Veteran Frank Castro
June 18, 2015 | Graphic USAEstimated reading time: 1 minute
Frank Castro, a highly experienced and well regarded expert of the PCB Industry has joined Graphic USA, a global manufacturer of high-technology printed circuit boards. As Production Manager, Mr. Castro will oversee all of the manufacturing operations and processes of Graphic USA, with special emphasis on the engineering and manufacturing of Flex, Rigid Flex Circuits and Flex Heater products for the Medical, Military, Aerospace, Automotive and Consumer industries.
Most recently, Mr. Castro spent 12 years at Rigid Flex International where he also served as Production Manager and served many Southern California PCB Companies beginning with his early days at Hughes Aircraft (now Raytheon).
With the addition of Mr. Castro, Graphic USA continues on its path of long term investment in the US Market. With special expertise in the Flex Circuit and Rigid Flex Circuit Market, Graphic USA is able to offer the complete service from Application Engineering support to volume PCB manufacture. Graphic USA’s customers come from a wide range of industries including the Mil Aero, Medical and Commercial sectors.
Graphic USA is division of The Graphic Group, one of the most technically competent manufacturers of high-technology printed circuit boards. With headquarters in the UK and full service manufacturing facilities in the USA and China, The Graphic Group focuses on leading edge technology released to the most demanding international quality standards. HDI technology includes Rigid and Flex-Rigid Printed Circuit Boards with blind, buried, micro, copper and resin filled and stacked vias, sequential build-up, buried resistance and buried capacitance.
More Information can be found at www.graphic-usa.com and www.graphic.plc.uk,
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Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.
PCB007 Magazine October 2024: Alternate Metallization Processes
10/16/2024 | I-Connect007 Editorial TeamTraditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop taking us into new directions. In this issue of PCB007 Magazine, we examine the impact of alternate metallization methods giving a glimpse into how and when we will arrive at 'destination metallization'.
Partial HDI: A Complete Solution
10/10/2024 | I-Connect007 Editorial TeamWe recently spoke with IPC instructor Kris Moyer about partial HDI, a process that’s recently been growing in popularity. Partial HDI allows designers to escape route out from tight-pitch BGAs on one layer, where a mechanically drilled plated through-hole is not an option, while avoiding the complexity and expense of sequential lamination cycles. As Kris explains, this process doesn’t add much to the cost, and it’s fairly straightforward. But there are some competing signal integrity and fabrication requirements to contend with. We asked Kris to walk us through this process.
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Connect the Dots: Designing for Reality—Outer Layer Imaging
09/26/2024 | Matt Stevenson -- Column: Connect the DotsWelcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.