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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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I-Connect007 Seeks Experienced Editor
July 3, 2015 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is expanding its editorial department. The No. 1 source of information for the PCB design, fabrication and assembly/EMS markets is seeking an experienced editor to help us take our publications to the next level.
“We work hard, but we have a lot of fun,” said Andy Shaughnessy, managing editor of The PCB Design Magazine and PCBDesign007. “The right candidate will have industry experience and enjoy working independently and with teams in a systems-based environment.”
Do you have the following qualifications?
- Strong writing, editing and grammar skills
- Electronics industry experience a plus
- Ability to work independently in a virtual environment
- Ability to manage multiple deadlines
- Great organizational and project management skills
- At least five years of editing and writing experience, with clips or links of published content
- Degree in Journalism, English or Communications preferred
- Familiarity with AP style
This editor will manage content for I-Connect007 properties on a daily basis.
Candidates should have fantastic communication skills (in person and electronically), and be able to work well with other team members and customers located around the globe.
Do you have what it takes to be an I-Connect007 editor?
If you’re interested in this position, click here.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
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SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.