Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Molex Launches MiniMix Connectors for Humanoid Robotics

08/06/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, unveiled MiniMix Hybrid Power and Signal Connectors, a purpose-built interconnect platform designed to solve manufacturing and packaging challenges in next-generation humanoid robotics, autonomous mobile robots (AMRs) and advanced industrial automation systems.

Molex Completes Acquisition of Teramount Ltd.

05/07/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

Molex Accelerates Supply Chain Transformation with Celonis AI

04/17/2026 | BUSINESS WIRE
Celonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.

Molex Accelerates Supply Chain Transformation with Celonis AI

04/16/2026 | BUSINESS WIRE
Celonis, a global leader in Process Intelligence, announced a successful collaboration with Molex, a global electronics leader and connectivity innovator, demonstrating that process context provides the essential foundation for reliable, scalable Enterprise AI.

Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption

04/15/2026 | PRNewswire
Molex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in