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From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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Fast Interconnect Announces Multi-Platform Design Services
September 2, 2015 | Fast InterconnectEstimated reading time: 1 minute
Fast Interconnect is now offering its customers a choice of CAD software platforms. According to co-founder Gary Griffin, “One large benefit of coming to Fast Interconnect is that fact that we can design your product in your existing CAD software package. Many companies that ask for design updates find it hard to find a company to assist them that can use the software they have established as their core software design suite.”
This provides immediate advantages for PCB designers.
“Keeping the design in the software currently being used enables the customer to have a useable database in their archive that their engineers are comfortable with. This also means that for future updates the customer is not forced to remember what package was used and where it was done,” Griffin continued. “This provides a freedom from being forced to go with a different design package simply because you are in a hurry and don’t feel you have a choice. We provide that freedom of choice.”
The available CAD packages are Mentor Graphics PADS/Xpedition®/xDX Designer, Cadence Allegro®, Zuken CADSTAR, Altium, P-CAD and Protel. Schematic capture packages for all of the aforementioned, as well as Cadence OrCAD.
As a value-added service, Fast Interconnect performs a full CAM preview of the Gerber files before they are released to the customer. This ensures there are no issues that were not evident during the design review.
For more information, visit www.fastinterconnect.com.
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