Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand
It’s Only Common Sense: Stop Pitching, Start Listening
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
Army Expands Planning for Cyber Future
September 15, 2015 | U.S. ArmyEstimated reading time: 1 minute
The U.S. Army requirements, acquisition, and research and development cyber community met here to collaborate on various cyber initiatives. The U.S. Army Research, Development and Engineering Command's Communications-Electronics Research, Development and Engineering Center, or CERDEC, sponsored the collaboration engagement, which was hosted by the Training and Doctrine Command's, or TRADOC's, Cyber Center of Excellence commanding general, Maj. Gen. Stephen G. Fogarty.
"This meeting is intended to build and strengthen partnerships to gain and ensure a common understanding amongst key stakeholders on shared equities in order to achieve efficient and effective support to the warfighter in cyberspace operations," Fogarty said.
The meeting was a follow-on to an April meeting between the Training and Doctrine Command's Centers of Excellence for Intelligence and Cyber, or ICoE and Cyber CoE.
"Maj. Gen. Robert P. Ashley, former Intelligence Center of Excellence commanding general, and I agreed this past December that a home-on-home between the ICoE and the Cyber CoE was long overdue," Fogarty said. "The initial two-day home-on-home collaboration engagement was to be between the Cyber COE and ICoE, followed by continued engagements with additional cyber stakeholders."
ICoE and Cyber CoE are two key cyberspace stakeholders in TRADOC. The two are tightly aligned on their cyber strategic plan and associated implementations based on Doctrine, Organization, Training, Materiel, Leadership, Personnel and Facilities, or DOTLMPF, assessments, said Patricia Rimbey, CERDEC Intelligence and Information Warfare Directorate, or I2WD, liaison officer to and co-located with the Cyber CoE.
The cyber and intelligence CoEs train and develop Soldiers and shape Army doctrine for their respective areas, but they engaged additional cyber stakeholders ranging from research and development, acquisition, test and sustainment communities for the home-on-home.
"The Army can't afford to continue to stovepipe solutions in any of its systems, but we especially can't afford it in our cyber solutions where the environment changes every day and introduces new threats every day. Meetings like these help shape and inform requirements that TRADOC identifies as cyber needs for Soldiers," said Dr. Paul Zablocky, CERDEC I2WD director.
Share on:
Suggested Items
ESIA Statement on EU Funding for Competitiveness: A New Approach is Needed
05/09/2025 | ESIAThe European Semiconductor Industry Association (ESIA), representing the European leadership in semiconductor research, design, and manufacturing, would like to underscore the need for targeted and sustained investment to strengthen Europe’s strategic sectors.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
Hon Hai Research Institute Demonstrates Superiority of Shallow Quantum Circuits Beyond Prior Understanding
05/05/2025 | Hon Hai Technology GroupHon Hai Research Institute (HHRI), in a milestone collaborative effort, has demonstrated that parallel quantum computation can exhibit greater computational power than previously recognized, with its research results accepted for publication in the prestigious journal Nature Communications.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
Meet Thiago Guimaraes, IPC's New Director of Industry Intelligence
05/05/2025 | Chris Mitchell, IPC VP, Global Government RelationsThe fast pace of innovation in the electronics manufacturing industry means business owners must continuously adapt their processes and capabilities to meet changing customer demands and market trends. To that end, IPC has hired Thiago Guimaraes as the new director of Industry Intelligence. In this interview, Thiago shares key goals and objectives that could revolutionize the industry as he helps stakeholders navigate industry trends and challenges.