-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
DuPont Microcircuit Materials Intros New Inks for Printed Electronics
September 22, 2015 | DuPontEstimated reading time: 1 minute
DuPont Microcircuit Materials (DuPont) is launching electronic inks that cure quickly at low temperatures, expanding the possibility of printing electronics onto an entirely new group of plastic films. The technology is expected to enable electronic components such as sensors, heaters and antennas to be printed on more versatile and less expensive substrates.
“This really opens new doors for application designers,” said Kerry Adams, segment manager, DuPont Microcircuit Materials. “As DuPont continues to expand its portfolio of advanced materials to meet the needs of the printed electronics market, we continue to look for ways to offer cost savings and the potential to put electronics into almost any device.”
Historically, electronic inks have required curing temperatures between 100°C and 140°C restricting electronic substrates to those that can survive at high temperatures. The new DuPont PE827 and PE828 low-temperature inks cure at as low as 60°C, opening up the possibility for printed electronics designers to use less expensive plastic films. By expanding substrate choices, the possibility for implementing printed electronics in new applications continues to grow. Potential applications could include printed antennas, sensor applications, heated surfaces and smart packaging applications.
Substrates that are now viable options for printed electronics include PVC, polystyrene, high-density polyethylene, and acrylic polymers, among others.
DuPont Microcircuit Materials (MCM) is a leading innovator and high-volume supplier of electronic inks and pastes that offers a broad range of printed electronic materials commercially available today. The growing portfolio of DuPont MCM electronic inks is used in many applications, including forming conductive traces, capacitor and resistor elements, and dielectric and encapsulating layers that are compatible with many substrate surfaces including polymer, glass and ceramic.
MCM has over 40 years of experience in the development, manufacture, sale and support of specialized thick film compositions for a variety of electronic applications in the consumer electronics, automotive, photovoltaic, biomedical, military and telecommunications markets. For more information on DuPont Microcircuit Materials, visit http://mcm.dupont.com.
About DuPont
DuPont has been bringing world-class science and engineering to the global marketplace in the form of innovative products, materials, and services since 1802. The company believes that by collaborating with customers, governments, NGOs, and thought leaders we can help find solutions to such global challenges as providing enough healthy food for people everywhere, decreasing dependence on fossil fuels, and protecting life and the environment.
Suggested Items
TT Electronics Secures Multi-Million-Pound Defense Contract with Ultra PCS
07/18/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced that it has been awarded a significant new contract with long-standing customer Ultra PCS Ltd (Ultra Precision Control Systems).
Tata Electronics, Bosch Sign MoU for Strategic Collaboration in Electronics and Semiconductor Manufacturing
07/18/2025 | Tata ElectronicsTata Electronics, a leading player in the Indian electronics and semiconductor manufacturing sector, and Robert Bosch GmbH, a leading global supplier of technology and services, announced that they have signed a Memorandum of Understanding (MoU) to collaborate on several key areas within the electronics and semiconductor industries.
Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions
07/18/2025 | Globe NewswireThe growth of artificial intelligence (AI) and the electrification of everything are driving an ever-increasing demand for higher levels of power efficiency and reliability.
Hyliion Awarded U.S. Navy Contract to Advance Multi-Unit KARNO Power Module
07/18/2025 | BUSINESS WIREHyliion Holdings Corp., a leading provider of innovative KARNOTM Power Modules, announced it has been awarded a Phase II Small Business Innovation Research (SBIR) contract in the amount of $1.5 million from the U.S. Navy to further develop and refine its scalable multi-megawatt platform for shipboard and stationary military applications.
Libra Industries Launches In-House High Precision Underfill Capabilities
07/17/2025 | Libra IndustriesLibra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities.