-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueDon’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
Material Matters
Materials management is nuanced, multifaceted, and requires a holistic systems approach for business success. When building high mix, low volume, and high technology, managing materials and overall cost containment are even greater challenges.
Additive Manufacturing
In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Multilayer Technology Invests in Orbotech Sprint 120 Inkjet Printer
September 22, 2015 | Multilayer TechnologyEstimated reading time: 2 minutes
Multilayer Technology (MLT), located in Irving, Texas has added new Orbotech Sprint™ 120 Inkjet Printer to its growing list of equipment upgrades. This Orbotech is the current state-of-the-art in the area of high-viscosity ink jet printing. Marvin Potter, operations manager, stated, “This recent addition will make the task of individual serialization on military products a much simpler operation.”
“Multilayer had looked at a number of ways to accomplish this critical task as the majority of our current business is in the area of QTA with lead times less than five days. This task of individual serialization was very cumbersome and time consuming. The ink jet process proved to be the best process and allowed us to keep with the same materials utilized to make the other marking’s on the circuit board as well," Potter added.
“We have utilized a number of inkjet printing systems in the past and this is the first system that allows for printing of high viscosity inks and also include an inline nozzle cleaning system to ensure the product will always be ready for use no matter the level in inactivity," said President Viny Mulani.
“This is the first system I have seen that allows us to go down to a .5mm feature and still have the nomenclature legible. With the current densification of products we are seeing it has become almost impossible to continue to utilize the conventional screen print or UV exposure process,” noted QA Director Rick Conden.
In the inkjet process, users only utilize the amount of ink that is needed, so there is a reduction in the amount of ink used and the loading in the developer is no longer an issue. Waste treatment has also benefited as the amount of Zinc in the waste water stream has been drastically reduced.
About Multilayer Technology
Multilayer Technology is a domestic leader providing the nation with cutting-edge capabilities. The company understands the urgency of first-to-market and helps customers deliver it. The company offers a one-stop solution to PCB needs, including prototype, production and high-volume quantities. Its success is based on confidence and integrity company-wide. The company strives for perfection and delivers it.
Multilayer Technology International has been providing PCBs for Fortune 500 companies and start-ups since 1986. It manufactures a wide range of technology, utilizing unique materials and processes fora broad range of customers ranging from Telecom, Medical, Instrumentation, Pipeline and Oil, Logging, Military Defense, Automated Test Equipment (ATE) and Aerospace. For more information, visit www.multilayer.com.
Suggested Items
Airbus to Lead NATO Next Generation Rotorcraft Capability Concept Study
07/26/2024 | AirbusThe NATO Support and Procurement Agency (NSPA) has awarded a contract to Airbus Helicopters to lead a concept study in the frame of the Next Generation Rotorcraft Capability (NGRC) project under which the participants combine efforts to work on design, development and delivery of a medium multi-role helicopter.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
SEMI Applauds U.S. Chips Act Award For Entegris Semiconductor Materials Facility in Colorado
07/01/2024 | SEMISEMI, applauded the United States Department of Commerce's announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Entegris construction of a state-of-the-art manufacturing center for advanced materials and process solutions for leading-edge semiconductors in Colorado Springs, Colorado.
Lockheed Martin Celebrates Opening Of 122,000-Square Foot, $18M Engineering Facility In North Alabama
05/31/2024 | Lockheed MartinLockheed Martin, U.S. Department of Defense, state and local officials celebrated the opening of the company’s new $18 million engineering facility, labs and demonstration center in Huntsville. The 122,000-square foot facility has space for 500 employees who will advance national security capabilities and drive innovation in North Alabama.
RTX's Collins Aerospace Awarded Survivable Airborne Operations Center Subcontract
05/27/2024 | RTXCollins Aerospace, an RTX business was awarded a multi-billion-dollar subcontract as part of a team led by SNC to design, develop and deliver systems and products for a new aircraft under the U.S. Air Force's Survivable Airborne Operations Center (SAOC) program.