-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Mentor Graphics Helps Bridge Gap Between PCB and RF
September 23, 2015 | Barry Matties, Publisher, I-Connect007Estimated reading time: 3 minutes

I recently attended IMS 2015, a show that focuses primarily on RF and microwave technology. During the show, I met with Per Viklund, the director of IC packaging and RF product lines at Mentor Graphics, and Alex Caravajal, business development manager with Mentor Graphics. We talked about the challenges facing PCB designers working with RF and microwave technology, and Mentor’s efforts to help reduce the RF design cycle time.
Barry Matties: Per, please begin by giving a quick overview of what Mentor Graphics is featuring here at IMS.
Per Viklund: Specifically for this show, we're focusing on the RF. Our customers have told us for a long time that it takes too long to develop RF circuits, especially when RF is going to be a piece of a bigger system. It's not so often that RF engineers have told us that. It's the PC board integrators who receive the RF circuit for integration and the management who sees long engineering times, lots of re-spins, that clearly says it can't be real to have these long cycles, or it can't be correct to have to do five or six iterations. There's got to be a different way. Not often will the entire engineering organization admit that there is a better way.
Matties: When we talk about cycles, what sort of cycle times are we talking about?
Viklund: It could be different depending on if you're doing a simple project or a larger one. But we have some cycle times that can be over two months long, say, if you are doing a board for a satellite communication link or something like that. They could have very long cycles.
Matties: As you were saying, there are many iterations.
Viklund: There are many iterations, because first you try to simulate, and it doesn't work so you try again. And that intricate process takes a long time because every time you have to send data back and forth between RF design tools and board tools and integrate and simulate and so on. It just takes a long time. You might be surprised how many people still use the ASCII files that transfer RF circuits from, for example, ADS or National Instruments Microwave Office into board tools. And when they do it that way, it becomes a dumb metal blob that the tool cannot make anything smart out of. It's just a blob; you can place it and it comes out in your fabrication data. But the problem is, every time something changes, they have to do that entire process again because there is no intelligence.
So what we try to help these companies with is to say, "Well, if you have intelligent data in your ADS or Microwave Office tool, let's try to maintain that intelligent data in a round trip.” So that you can send that data into our tools and implement it into a bigger system, bigger context, but still maintain all the parametric shapes and programmable shapes that you have. You’re able to set up things like tuning expressions and then, by just a push button, send the data back into ADS or Microwave Office again to analyze and make adjustments, optimize and then just send the adjustments back into our tools again. But that loop has actually proven to shorten this design cycle by more than 50% in most cases. It’s significant.
Matties: People must be pretty excited about that.
Viklund: They are very excited about it. But it's hard sometimes to adapt a new methodology. If you've been doing one thing for 20 years and now suddenly we tell you to do something different, and you won’t see the benefit until the middle or end of your project rather than immediately, that's challenging to people. They say, “I know I have a pretty good project. You're telling me to use a little bit of time up front.” Yes, I am, and you're going to gain it back. People are more and more adapting to this.
To read this entire article, which appeared in the August 2015 issue of The PCB Design Magazine, click here.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
PCB East Continues to Expand
05/06/2025 | Andy Shaughnessy, Design007 MagazineIt was a perfect week for a conference and trade show in metropolitan Boston, with high temperatures in the 70s. PCB East took place at the Boxboro Regency Hotel and Conference Center April 29–May 2, with the expo on April 30. PCB East has been expanding since its relaunch a few years ago, with conference and show attendance rising each year.