-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueChips Don't Float
In Europe and the U.S., legislation is under way to revitalize PCB fabrication and packaging. What is the status of this work, and how specifically does this change the industry landscape for EMS companies? What will help keep us afloat?
Flying High With Digital Twin
The opportunity to use manufacturing simulation as a test bed for job planning and process optimization brings continuous improvement into the modern age. This may be an all-or-nothing type of project, but it’s worth the investment.
Artificial Intelligence
In this issue, we (and AI) explored how and when artificial intelligence plays a role in manufacturing today. Whether on the factory floor, or in the front office, AI applications are emerging and changing how we approach planning, processes and problem solving.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
ZESTRON's Umut Tosun to Present at SMTA International 2015
September 24, 2015 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that Umut Tosun, M.S.Ch.E., Application Technology Manager, ZESTRON Americas, will present “Impact of Multiple Thermal Cycles on the Cleaning Process” at SMTA International 2015.
Printed circuit board manufacturing is a highly complex process and incorporates numerous steps. The soldering process is critical and may include reflow oven and/or wave solder equipment as well as a baking process. PCBs may be single or double-sided in which case multiple thermal cycles are required. There are many opportunities to clean PCBs following a soldering process, either from single, dual or dual and baked thermal cycles. This study was conducted to assess the effects of numerous thermal cycles on the PCB cleaning process. Solder pastes considered included RMA, No Clean and Water Soluble (OA), both leaded and lead-free.
SMTA International 2015 will be held at the Donald Stephens Convention Center in Rosemont, IL from September 29 to September 30. Mr. Tosun will present during the “Cleaning Parameters and Cleanliness Monitoring of Electronics Assemblies” session on September 30, at 8:00 AM. For more information on our process solutions, services and learning opportunities, please visit booth #616.
About ZESTRON
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With six worldwide Technical Centers and the largest team of chemical engineers in the industry, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
Suggested Items
The End of Solder?
09/28/2023 | Nolan Johnson, I-Connect007The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
Nihon Superior’s Mr. Keith Sweatman to Present at the 2023 SMTA International Technical Conference
09/27/2023 | Nihon Superior Co. Ltd.Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition.
Kyocera International Orders Hentec Industries/RPS Automation Odyssey Component Lead Tinning System
09/27/2023 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Guadalajara Expo & Tech Forum
09/26/2023 | Conecsus Metals MéxicoConecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Foro Tecnico & Expo, Guadalajara, Jalisco, México, on Wednesday, October 25, 2023, beginning at 11:00 a.m.
Thermaltronics to Showcase Cutting-Edge Soldering Solutions at SMTA Guadalajara Expo & Tech Forum
09/21/2023 | Thermaltronics USA, Inc.Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023.