The Application of Advanced Ultrasonics in Metal Plating Processes
October 12, 2015 | Stuart Dalrymple, C-Tech InnovationEstimated reading time: 3 minutes
Most surface modification chemical treatments by their very nature contain hazardous and oxidising chemicals; there is a major concern that these chemicals are used maliciously with the intent to manufacture explosives or formulate poisons to harm the public. Cyanide-based plating solutions and high concentrations of hydrogen peroxide used in current techniques are a significant use of these materials in industry.
The use of cyanide and hydrogen peroxide is concentrated in a few industries: large polymer manufacturers, chemical manufacturers, and surface finishing companies. Surface finishing/PCB manufacturing is a particular risk as in general the sites where these processes are run are small, distributed and less secure than large chemical plants. Consequently, amounts of these dangerous substances are found across the UK with varying and sometimes limited control over their use, representing a significant risk.
Barriers to implementation of cyanide-free plating solutions are related to quality of product and operational requirements. Introduction of the novel ultrasound technology can overcome these barriers, but must be validated on full scale processes and over a range of plating systems.
The introduction of ultrasound to current industrial protocols has been demonstrated in the first phase of the Reprime project to allow the removal of cyanide from metal plating processes, and significantly reduce the amount of hydrogen peroxide use. A small test plating line was set up featuring an ultrasound tank in which barrel plating, vat plating or PCB etching could be performed.
Figure 1: Ultrasound reactor showing ultrasound transducers (left) and barrel plating (right).
Results from zinc plating trials on fixings, showed that cyanide free solutions could be improved in terms of the weight addition and the coverage consistency with appropriate application of ultrasound. The technique particularly aids coverage when used on unusual shapes and through holes which are typically problematic with cyanide free solutions.
Figure 2: Improved plating rate on hex-nuts in acid based zinc plating solutions when ultrasound is applied.
Ultrasound was shown to reduce the levels of hydrogen peroxide required in etchant solutions used in PCB manufacturing. However, the biggest improvements were seen when considering bath life. Baths treated with a particular configuration of ultrasound could perform for significantly longer timescales without performance degradation. Therefore, bath chemistry can be replenished at a less frequent rate, reducing chemical use and handling requirements.
Figure 3: PCB test materials untreated (left) and treated (right) with a hydrogen peroxide based etchant.
To go beyond the current process development and achieve impact in industry, the scope of work must be increased to test at an industrially relevant scale and to broaden the range of processes covered. Work is currently focussed on making cyanide free technology more attractive on performance grounds to overcome barriers to implementation. Overall aims of the project are as follows:
- Demonstrate that zinc plating can be achieved at a scale relevant to industrial systems
- Ensure technology can be easily used with existing equipment
- Extend plating trials to other cyanide plating systems such as copper, gold and silver to cover the bulk of the industrial processes
- Carry out hydrogen peroxide etch at full PCB manufacturing scale and prolonged bath life trials
- Work with industry bodies such as the Surface Engineering Association (SEA) and ICT (institute of Circuit Technology) to engage and inform industry
There is huge potential for this technology to make a positive impact on the reduction of dangerous chemicals with over 1000 factories in the UK operating surface finishing or PCB manufacturing processes. The output from these industries are cross-sectoral, including vast markets within the automotive, aerospace, and electronics sectors. It is hoped that through this research work, a viable technical solution can be applied through this industry.
Stuart Dalrymple is a project manager at C-Tech Innovation with experience running research projects in the areas of process engineering, surface finishing and environmental assessment.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.
Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications
04/08/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.