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Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4Last Call for IPC Flexible Circuits-HDI Forum Registration
October 22, 2015 | IPCEstimated reading time: Less than a minute
The IPC Flexible Circuits-HDI Forum, scheduled for October 28-30, 2015, in Minneapolis, Minnesota, will provide attendees the opportunity to learn through various tutorials, speaker presentations, and keynote speeches.
Focusing on military, aerospace, medical, and automotive electronics industries, the event will feature senior technologists from companies including TTM Technologies, DuPont, Battelle, Multek-Flextronics, Insulectro, Firan Technology Group Corporation, Orbotech, eSurface, Science Applications International Corp. (SAIC), RBP Chemical Technology, and Intrinsiq Materials.
To register for the event, click here.
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