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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Rogers CFO David Mathieson Plans to Retire at Year End
November 2, 2015 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation, a global leader in engineered materials solutions, announced today that Vice President of Finance and Chief Financial Officer, David Mathieson, is retiring effective December 31, 2015. The Company expects to announce Mathieson’s successor shortly.
Bruce Hoechner, Rogers’ President and Chief Executive Officer commented, “I want to thank David for his financial leadership during his service with Rogers. Since joining us out of early retirement in May 2014 he assisted us at a critical point during our successful acquisition of Arlon, helped us restructure our debt, raised our visibility in the capital markets and further developed our global finance organizational capabilities. We wish him all the best as he returns to his retirement.”
About Rogers Corporation
Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, safety and protection applications as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Connecticut (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
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Sealed for Survival: Potting Electronics for the Toughest Environments
10/29/2025 | Beth Massey, MacDermid Alpha Electronics SolutionsElectronics deployed in harsh conditions face relentless threats from vibration, impact, chemical contaminants, airborne pollutants, and moisture, conditions that can quickly lead to failure without robust protection. Potting, the process of encapsulating electronics in a protective polymer, is a widely used strategy to safeguard devices from both environmental and mechanical hazards.
Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
10/28/2025 | Kurt Palmer -- Column: Driving InnovationRigid-flex printed circuit boards are a highly effective solution for placing complex circuitry in tight, three-dimensional spaces. They are now indispensable across a range of industries, from medical devices and aerospace to advanced consumer electronics, helping designers make the most efficient use of available space. However, their unique construction—combining rigid and flexible materials—presents a fundamental challenge for PCB manufacturers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
ITW EAE Despatch Ovens Now Support ASTM 5423 Testing
10/15/2025 | ITW EAEAs the demand for high-performance electrical insulation materials continues to grow—driven by the rapid expansion of electric vehicles (EVs) and energy storage systems—thermal processing has become a critical step in material development.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).