Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
ACE Introduces Revolutionary Low Cost Dip and Look Solderability Tester
November 4, 2015 | ACE Production Technologies Inc.Estimated reading time: 1 minute
ACE Production Technologies, Inc., a leading supplier of selective soldering systems, lead tinning systems and lead tinning services, is pleased to announce the introduction of its revolutionary low cost STS-202 dip and look solderability test system.
The new ACE solderability tester is capable of performing solderability testing to determine the solderability of component leads and terminations prior to being joined in a soldering operation. The system utilizes the proven dip and look test method in conformance with all IPC, ANSI and MIL standards including J-STD-002, MIL-STD-883 Method 2003 and MIL-STD-202 Method 208.
The well-defined dip and look solderability testing method is an easy way to perform qualitative type testing utilizing a straightforward comparative analysis technique. And since the dip and look test can be performed rapidly it can be effectively used in receiving inspection or on a production floor as well as in a testing laboratory.
Designed to automate the physical testing process, the benchtop STS-202 solderability tester utilizes high precision motion control, easy touch screen programming and precise PID temperature controls for complete process control throughout the entire testing operation. The new ACE solderability tester is an intelligent dual purpose system that can be used for solderability testing as well as for manual component lead tinning for low volume applications.
Removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation are the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. It is highly recommended the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with GEIA-STD-0006 to enhance component solderability.
About ACE
ACE Production Technologies, Inc. designs and builds simple and affordable selective soldering and lead tinning systems suitable for lead-free and tin-lead electronics assembly. ACE’s complete line of rugged and reliable selective soldering systems all feature lead-free compatible solder pots and are ideal for low, medium or high volume production. ACE also provides solderability testing, lead tinning services and process development services.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.