Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Global SiC Substrate Revenue Declines 9% in 2024; Long-Term Demand Remains Strong as 8-Inch Roadmap Gains Momentum

05/12/2025 | TrendForce
TrendForce’s latest research shows that weakening demand in the automotive and industrial sectors has slowed shipment growth for SiC substrates in 2024.

SAIC Awarded New $55 Million Mission Integration Contract From Space Development Agency

05/05/2025 | SAIC
Science Applications International Corp. has been awarded the Proliferated Warfighter Space Architecture (PWSA) Tranche 3 Program Integration (T3PI) contract from the Space Development Agency (SDA).

Driving Innovation: Registration in PCB Production Throughout the Process

05/06/2025 | Simon Khesin -- Column: Driving Innovation
PCB manufacturing is a fascinating industry where multiple disciplines—chemical, mechanical, and optical processes—intersect. Each field plays a crucial role, and missing even one step can significantly impact production and yield. In the realm of mechanical and optical processes, one of the most critical aspects influencing the final result—especially in complex PCB designs—is registration.

OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.

Tandem Panel Shipments to Jump Again to 36% in 2026

04/25/2025 | BUSINESS WIRE
According to recent display industry research from Omdia, tandem RGB penetration into the OLED tablet and notebook panel markets surged from almost zero to more than 30% in 2024.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in