-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Schmoll Introduces New MDI Product at productronica 2015
November 20, 2015 | Burkle North AmericaEstimated reading time: 1 minute

During the most recent Productronica show held in Munich, Germany, Schmoll Maschinen GmbH introduced the new Micromirror Digital Imaging System (MDI), a digital direct imaging system using Digital Micromirror Device (DMD) technology. This new technology transfers UV light images to the circuit board substrate using high resolution micromirror chips.
As a new technology, Schmoll brings to the industry a robust granite platform system ensuring image stability suitable for photoresist inner layer/outer layer and solder mask applications. Three systems are available including a single table system, a double table system for faster throughput and larger table surface for sizable panels. The system can be configured for one to as many as six heads for higher throughput.
The MDI-ST and the MDI-DT are assembled on a stable granite platform with a precision table based on Schmoll’s extensive experience in both mechanical and laser drilling systems. The MDI Light Engine provides 2 million individually adjustable micromirrors for fine line imaging resolution. In addtion, the compact design and flexibility of these systems allow for economical use of floor space.
As the largest manufacturer of productive drilling and routing systems in the world, Schmoll Maschinen GmbH offers an economical approach with their extensive system and imaging technology to the PCB industry.
Bürkle North America has been the exclusive Schmoll distribution (parts, sales and service) partner in North America for over 10 years.
Contact Dave Howard 714-379-5090 for more information, or access www.burkleamerica.com for all up-to-date information on Schmoll product lines.
About Burkle North America - Bürkle North America, Inc. is a wholly owned division of Robert Bürkle GmbH, of Freudenstadt, Germany. Bürkle is the leading manufacturer of productive manufacturing technologies serving a variety of manufacturing industries, including surfaces / woodworking technologies, photovoltaic module lamination and coating, printed wiring board fabrication and plastic card fabrication.
Schmoll Maschinen – Schmoll Maschinen is one of the leading suppliers of machine tool and mass production solutions for electronic and micro structuring applications with more than sixty years of engineering experience. Schmoll’s solution portfolio covers all performance relevant steps for mechanical and laser micro machining and is complemented by automation technology.
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.