Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Ventec International Group and TMT Trading Announce Intention to Merge
January 4, 2016 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group, a world leader in the production of polyimide and high reliability epoxy laminates and prepregs, announced the intention to merge with TMT Trading GmbH, a leading distributor of PCB base-materials including consumables and flex- and rigid-flex circuit board materials. The intention to merge was officially announced today and is expected to take effect in early 2016.
The management of Ventec International, headquartered in Suzhou, China, and TMT Trading GmbH, headquartered in Kirchheimbolanden, Germany, announced today that they have entered into discussions to merge TMT with the Ventec International Group. The merger is planned for early 2016. Until that time, both companies will remain fully independent entities and business will continue as usual.
The merger will widen Ventec’s product offering to include complementary products such as back-up, entry & routing materials, foils, clean room products and coatings, offering a one-stop-shop for customers of laminates and PCB base materials.
Tony Lau, Ventec International Group’s CEO commented: “Our combined company will be in a stronger position for continued growth over the long term. We will have enhanced product offerings, allowing us to better serve our global clients, as well as the opportunity to attract new customers and expand into new niche markets.”
Thomas Michels, CEO of TMT and Managing Director of Ventec Central Europe added: “TMT has been working in partnership with Ventec for a number of years. A merger is a natural progression in the relationship, which will greatly benefit both our customer bases through the synergies our partnership bring.”
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
About TMT Trading GmbH
TMT Trading GmbH is a leading distributor of base-materials, laminates, drilling boards and other consumables for the manufacture of printed circuit boards for a diverse range of applications. TMT's global distribution network enables the supply to customers in all regions of the world. For more information, visit www.tmt-company.com.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.