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Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
In this issue, the biggest names in PCB manufacturing share their economic outlook for the upcoming year and beyond. As you will see, they were all bullish on our industry, but there was some apprehension as well. No one wants to get burned by another the supply chain disruption.
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Ventec International Group and TMT Trading Announce Intention to MergeJanuary 4, 2016 | Ventec International Group
Estimated reading time: 1 minute
Ventec International Group, a world leader in the production of polyimide and high reliability epoxy laminates and prepregs, announced the intention to merge with TMT Trading GmbH, a leading distributor of PCB base-materials including consumables and flex- and rigid-flex circuit board materials. The intention to merge was officially announced today and is expected to take effect in early 2016.
The management of Ventec International, headquartered in Suzhou, China, and TMT Trading GmbH, headquartered in Kirchheimbolanden, Germany, announced today that they have entered into discussions to merge TMT with the Ventec International Group. The merger is planned for early 2016. Until that time, both companies will remain fully independent entities and business will continue as usual.
The merger will widen Ventec’s product offering to include complementary products such as back-up, entry & routing materials, foils, clean room products and coatings, offering a one-stop-shop for customers of laminates and PCB base materials.
Tony Lau, Ventec International Group’s CEO commented: “Our combined company will be in a stronger position for continued growth over the long term. We will have enhanced product offerings, allowing us to better serve our global clients, as well as the opportunity to attract new customers and expand into new niche markets.”
Thomas Michels, CEO of TMT and Managing Director of Ventec Central Europe added: “TMT has been working in partnership with Ventec for a number of years. A merger is a natural progression in the relationship, which will greatly benefit both our customer bases through the synergies our partnership bring.”
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
About TMT Trading GmbH
TMT Trading GmbH is a leading distributor of base-materials, laminates, drilling boards and other consumables for the manufacture of printed circuit boards for a diverse range of applications. TMT's global distribution network enables the supply to customers in all regions of the world. For more information, visit www.tmt-company.com.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.