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Plasma Etch to Hold Live Plasma Cleaning Demonstration at MD&M West 2016
January 4, 2016 | Plasma Etch, Inc.Estimated reading time: 1 minute
Plasma Etch Inc, a leader in plasma treatment, will be providing live demonstrations of the company’s popular PE-50 Plasma Cleaner to attendees at the Med Tech World MD&M West 2016 trade show. The show runs February 9 – 11 at the Anaheim Convention Center in Anaheim, California.
This is a great opportunity for medical design manufacturers to get their hands on a working PE-50 Plasma Cleaner. Company representatives will be on hand to answer questions and provide live demonstrations. The demonstrations will be performed at booth number 2078.
The PE-50 is an affordable, entry level option for most types of plasma treatment. This unit is very popular at universities and research labs. Plasma Etch credits the PE-50’s success to its versatility and robust design. This system is popular for small production facilities, research labs, universities, and startup manufacturers in need of a small-scale, cost-effective plasma treatment solution.
The opening price point includes industry leading features such as an oxygen safe vacuum pump and the ability to run two gasses simultaneously. The PE-50 features simple controls and easy to read indicators for monitoring the plasma processing sequence.
If you don’t make it to the show, you can view all of Plasma Etch’s innovative products anytime on their website: www.plasmaetch.com.
About Plasma Etch
Plasma Etch is a leading manufacturer and industry innovator since 1980. The company holds several patents for the invention, development and manufacturing of groundbreaking innovations; paving the way for plasma technology and the enhancement of quality manufacturing worldwide. Plasma Etch specializes in plasma cleaning solutions of all sizes. Their products are industry proven, and set the standard for reliability, speed and uniformity in plasma processing.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
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