-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAlternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Ventec to Unveil New 'tec-speed' Brand for High Speed/Low Loss Materials at DesignCon 2016
January 13, 2016 | Ventec International GroupEstimated reading time: 2 minutes
Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will exhibit in Booth 118 at DesignCon 2016 (January 20th to 21st 2016, Santa Clara, CA, USA) where the company will launch a new brand identity, tec-speed, for its high speed/low loss product line. With the launch, Ventec will unveil a new logo, marketing collateral and technical specifications.
The creation of the brand name 'tec-speed' is a move to unite Ventec's high speed/low loss product portfolio and better position the range under a single identity, connecting the products through a clear and cohesive visual presentation.
Martin Cotton, Director OEM Technology, commented: “The tec-speed brand now unites one of the most comprehensive range of products in high speed/low loss PCB material technology. Every tec-speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.”
Ventec International Group’s COO USA & EUROPE, Mark Goodwin added: “With the growing demand for high reliability and high speed computing & storage applications, and a pipeline of new innovative additions to our range, the timing is right to give our product line a clear identity. More than that, our unique approach to supply chain ownership, with a manufacturing and distribution network that covers the relevant markets globally, ensures fast delivery of quality materials”.
A selection of products will be highlighted at the show, including:
tec-speed 6.1 (Dk 3.2, Df 0.004 RC 50%) - Ultra-Low Loss High Tg material available with all copper styles, including HVLP. Uses Low Dk spread glass to improve Skew and Jitter. Applications include Telecom, Router, Servers etc. Specifically, backplane and daughter card designs where good Signal Integrity is essential. This material has excellent Thermal properties.
tec-speed 4.0 (Dk 3.8, Df 0.007) - Low-Loss High Tg material available with all copper styles, including HVLP. Applications focus on High Frequency & High Speed designs, Automotive and Satellite communication, Navigation, GPS, etc. are typical applications. This material has excellent thermal properties.
tec-speed 1.0 (Dk 3.9, Df 0.012 @ 10GHz RC75%) - Mid-Loss Mid Tg Halogen Free material available with all copper styles. Applications include hand-held products, specifically those that require high frequency high speed materials. This material has excellent thermal properties.
For more information about Ventec’s solutions and the company’s wide variety of products, please visit www.venteclaminates.com or download to the Ventec APP.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and quick-turn CCL manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, visit www.venteclaminates.com, www.ventec-usa.com or www.ventec-europe.com.
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.